Intel's underwhelming second-quarter 2024 financial results have prompted the company to announce plans to cut 15% of its workforce, approximately 15,000 employees, aiming to save...
India's smartphone market experienced a 7.2% shipment growth during the first half of 2024. However, as premiumization continues, consumer demand is expected to remain constrained.
Xiaomi Group Chairman Lei Jun announced on X (formerly Twitter) that the international version of Xiaomi's next flagship smartphone will collaborate with Google, leveraging Google...
SK Hynix has reportedly begun procuring production equipment for its M16 plant in Icheon, aiming to boost its monthly production capacity from 100,000 to 180,000 units, an increase...
Samsung Electronics (Samsung) is reportedly building an image quality lab for CIS. To catch up to Sony, it is planning on using simulated photography of various scenery to enhance...
Since taking the helm in February 2021, Intel CEO Pat Gelsinger has grappled with mounting losses at the company's foundry division. A critical challenge is establishing Intel Foundry...
Samsung Electronics has unveiled a groundbreaking 12nm low-power DRAM (LPDDR) with a thickness of just 0.65mm, responding to the rapidly growing on-device AI market. This move comes...
Samsung Electronics is developing high-performance semiconductors for next-generation Extended Reality (XR) devices, aiming to compete with Apple's Vision Pro, which uses in-house...
Samsung Display (SDC) is reportedly collaborating with Microsoft to develop and supply OLED on Silicon (OLEDoS) for the next generation of Mixed Reality (MR) devices.
Samsung Electronics is ramping up efforts to bolster its market share for foldable smartphones with the launch of the Galaxy Z Flip6 and Fold6, strategically aligning its campaign...
Samsung Electronics has clarified to DIGITIMES that testing of its 5G high-bandwidth memory (HBM3E) is still ongoing, despite recent reports suggesting successful completion...
SEMI Japan president Masayuki Hamajima recently called for the semiconductor industry to unify packaging technology standards as soon as possible, particularly in the advanced packaging...
