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Friday 26 September 2025
YMTC joins DRAM arena to ease China's AI memory crunch
China's growing demand for high-bandwidth memory (HBM) is reshaping its chip sector. Yangtze Memory Technologies Co. (YMTC), long centered on NAND flash, is planning to expand into...
Friday 26 September 2025
Micron rises to second in global HBM market as Samsung slips
Micron Technology has, for the first time, overtaken Samsung Electronics in the high-bandwidth memory (HBM) market, securing second place in global shipments during the second quarter...
Thursday 25 September 2025
Samsung pushes DRAM to record highs, SK Hynix scales up, CXMT struggles on DDR5
Samsung and SK Hynix are accelerating DRAM wafer production as demand rebounds and prices climb, while China's CXMT falls behind in the DDR5 transition, limiting its ability to compete...
Thursday 25 September 2025
Samsung eyes US launch for tri-fold smartphone, signaling strategy shift
Samsung Electronics is anticipated to unveil its tri-fold smartphone by the end of 2025, with reports suggesting it may be launched in the US market. South Korean media suggest the...
Wednesday 24 September 2025
China-based Longsys jumps on SOCAMM2 as Nvidia skips first-gen spec
The AI memory market is taking shape rapidly. China's Longsys has launched enterprise SOCAMM2 modules built on LPDDR5/5X, aiming to seize early opportunities in next-generation AI...
Wednesday 24 September 2025
Verizon forms 6G Innovation Forum with major industry partners, including Samsung
Verizon announced the formation of the 6G Innovation Forum, a collaborative group aimed at advancing the development of 6G wireless technologies. The forum includes major network...
Wednesday 24 September 2025
YMTC closes gap with global rivals: Xtacking 4.0 powers 267-layer NAND, eyes 300+
China's NAND flash race is intensifying, with Yangtze Memory Technologies (YMTC) pushing Xtacking 4.0 into mass production. The company has begun producing 267-layer 3D NAND TLC while...
Wednesday 24 September 2025
Huawei's custom HBM challenges the existing memory hegemony
China is moving aggressively into the high-performance DRAM market dominated by Samsung Electronics and SK Hynix, with its sights set on customized high-bandwidth memory (HBM). The...
Wednesday 24 September 2025
Global memory prices set to surge 15-25% in Q4 amid tightening supply
Consumers and businesses should brace for a surge in the cost of everything from smartphones to servers, as the global memory chip market stages a dramatic rebound. The industry's...
Tuesday 23 September 2025
Samsung reportedly struggles with HBM4 yields as SK Hynix leads memory race
Samsung is betting on advanced 1c DRAM-based HBM4 technology but remains constrained by 35% yields, while SK Hynix relies on stable production and Nvidia's trust to defend its lead...
Tuesday 23 September 2025
Tesla reportedly recruiting semiconductor talent to boost AI6 chip and 2nm Samsung collaboration
Tesla is actively recruiting semiconductor experts to enhance its next-generation chip development and mass production capabilities. Recent reports indicate that Samsung Electronics'...
Tuesday 23 September 2025
From stores to battlefields: Samsung Galaxy taps defense market
Samsung Electronics' Galaxy series devices generated nearly US$13 billion in revenue from business-to-business (B2B) and business-to-government (B2G) markets in 2024, accounting for...
Tuesday 23 September 2025
Samsung races to supply Nvidia with HBM3E, WAT results crucial
Despite previously facing overheating issues, Samsung Electronics is preparing to supply its fifth-generation high bandwidth memory (HBM3E) to Nvidia. However, opinions within the...
Tuesday 23 September 2025
TSMC extends lead in foundry market as Samsung loses ground
The global boom in artificial intelligence is creating a stark divide in the semiconductor industry, with Taiwan's TSMC solidifying its dominance while rival Samsung Electronics falls...
Tuesday 23 September 2025
Nvidia-Intel alliance deepens US-China tech divide
Nvidia said it will invest US$5 billion in Intel and broaden cooperation in semiconductor design and development. The deal does not include chip fabrication but is viewed as a key...