Despite a strong overall performance in the second quarter of 2024, Samsung Electronics continues to grapple with losses in its wafer foundry business. Most analyses indicate that...
Due to ongoing strikes, Samsung Electronics may face a semiconductor production crisis in the second half of 2024. To address communication issues between departments, Young-hyun...
Samsung Electronics reported strong results for the second quarter of 2024, with its Device Solutions (DS) division, led by memory chips and the System LSI Business, driving nearly...
The US government is considering imposing restrictions as early as August to restrict China's access to crucial High Bandwidth Memory (HBM) chips and related manufacturing equipment...
Samsung Electronics has released its financial report for the second quarter of 2024, revealing that its Mobile Experience (MX) division, despite showing improved revenue compared...
SK Hynix is reportedly considering an initial public offering (IPO) for its solid-state drive (SSD) subsidiary, Solidigm, in the US, following a surge in demand for enterprise SSDs...
As the flagship smartphone AP battleground officially enters the 3nm era in the second half of 2024, MediaTek, Qualcomm, and Apple are all said to be preparing chips with vast performance...
Samsung Electronics' HBM3E memory is in the final stages of its qualification test for a significant client, and shipments are expected to commence as early as August, according to...
Samsung Electronics has implemented the Overall Performance Incentive (OPI) reward system for over 20 years. In response to employee demands and to retain talent, the company is reportedly...
Samsung Electronics announced its financial results for the second quarter of 2024, reporting revenue of KRW74.07 trillion (approximately US$53.3 billion) and an operating profit...
Taiwan Fertilizer Company (TFC) is accelerating its industrial transformation by forging new partnerships with major international firms from Japan and South Korea, focusing on ammonia...
Samsung Electronics is preparing to launch its slimmest high-end foldable smartphone yet, the Galaxy Z Fold6 Slim. According to recent reports, this new model will boast a thickness...
Glass Core Substrate (GCS) is becoming a trend that major players in the semiconductor supply chain are avidly pursuing. LG Innotek is reportedly contacting material, components,...
South Korean media have recently forecasted that the investment strategies of South Korean and Taiwanese semiconductor firms in the United States could shift depending on the outcome...