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Monday 29 July 2024
S. Korea, Taiwan's semiconductor strategies may shift with US election outcome
South Korean media have recently forecasted that the investment strategies of South Korean and Taiwanese semiconductor firms in the United States could shift depending on the outcome...
Monday 29 July 2024
Samsung invests in AI chip startups DreamBig and Axelera AI
Samsung Electronics is ramping up investment efforts in AI chip startups to strengthen its competitiveness in new-generation AI semiconductor technologies.
Monday 29 July 2024
TSMC to start using high-NA EUV tools for A14P in 2028
TSMC has made a production roadmap for using high-NA EUV lithography equipment to make 1.4nm chips starting as early as 2028, according to industry sources.
Monday 29 July 2024
Japan bets on back-end processes to resurrect chip industry, attracting investments from TSMC, Samsung, and Intel
Japan is actively striving to revive its semiconductor industry and develop cutting-edge chips by leveraging its expertise in materials and equipment for back-end processes to venture...
Monday 29 July 2024
Samsung targets personalized AI applications; acquires UK startup with knowledge graph technology
Samsung Electronics has acquired the UK startup Oxford Semantic Technologies, known for its personalized AI technology, aiming to offer differentiated personalized AI experiences...
Friday 26 July 2024
NAND flash capex to slow in 2024
The world's top-3 memory chipmakers are likely to reduce their NAND flash memory capex in 2024, following two years of robust spending, according to industry sources.
Friday 26 July 2024
Samsung bets big on CXL for next-gen memory leadership
Samsung Electronics is aggressively targeting Compute Express Link (CXL), a highly anticipated next-generation memory technology. The CXL market is expected to take off in the second...
Friday 26 July 2024
Next-gen Samsung flagship tablet may use MediaTek chips
More information has been leaked about MediaTek's Dimensity 9300+ processor, which is expected to power Samsung Electronics' next-generation flagship tablet, the Galaxy Tab S10, according...
Thursday 25 July 2024
Samsung, SK Hynix keen to develop new TSV, focus ring, debonding solutions for next-gen HBM
As the number of DRAM stacks in high bandwidth memory (HBM) increases, there will be new developments in Through-Silicon Via (TSV) materials, focus rings and debonding technology...
Thursday 25 July 2024
Power crunch casts clouds over South Korea's largest chip cluster in Yongin
Samsung and SK Hynix plan to invest KRW360 trillion (US$259.2 billion) and KRW120 trillion, respectively, to build 10 semiconductor fabs in Yongin, South Korea, making it the world's...
Wednesday 24 July 2024
Samsung unveils the ultra-thin Galaxy Z Fold6 Slim to compete with Chinese rivals
Samsung Electronics, fresh off its July 2024 launch of new foldable phones, is gearing up to introduce a sleeker, more lightweight model: the Galaxy...
Wednesday 24 July 2024
Samsung HBM3 and HBM3E still pending Nvidia quality tests
Korean media reports said Samsung Electronics's 4-generation high bandwidth memory product (HBM3) has been validated and has started mass production. However, industry sources only...
Tuesday 23 July 2024
Apple's rumored foldable iPhone yields mixed news for Samsung
Recent rumors suggest that Apple is conducting research and development for its first "foldable iPhone," with a potential release targeted for 2026. Industry sources believe that...
Tuesday 23 July 2024
TSMC outpaces Samsung in HPC revenue growth for 2Q24
TSMC's high-performance computing (HPC) revenue share continued to rise in Q2 2024, boosting overall performance. Although Samsung Electronics aims to increase its HPC sales proportion,...
Monday 22 July 2024
Samsung increases number of MPW service offerings for fourth consecutive year
Samsung Electronics is set to increase its Multi-Project Wafer (MPW) service offerings for the fourth consecutive year, with plans to raise the number to 35 in 2025. This move not...