South Korea is building up the necessary infrastructure to position itself as a leader in the global electric vehicle (EV) supply chain, with its top three EV battery manufacturers...
Samsung SDI has been trimming its battery pack manufacturing business in China, having shut down two battery pack subsidiaries there in 2021, according to a Korean media report.
Infinenon Technologies has recently announced plans to invest over EUR 2 billion to build a new fab for wide bandgap (WBG) semiconductors (SiC and GaN) at its manufacturing complex...
Industry experts are optimistic that electric cars 2022 will continue to rise. Therefore, carmakers are trying everything to secure battery stock, including leaning toward lithium-iron-phosphate...
Rivian and Samsung SDI's joint plan to build lithium battery factory fell through, according to The Elec. The lithium battery industry, which has been embracing surging demand...
Thanks to the rising demand for electric vehicles (EV) and energy storage solutions, lithium-ion batteries are set to be the next strategic resource after semiconductors. Because...
Both third-generation semiconductor silicon carbide (SiC) power components and silicon-based insulated gate bipolar transistors (Si-based IGBT) are being used in electric vehicles...
Applications of third-generation semiconductors including SiC and GaN diodes, MOSFETs and related modules are set to take off in 2022, and Taiwan's semiconductor supply chain players...
Taiwanese IC design houses have gradually expanded their deployments in the segment of wide-bandgap (WBG) semiconductors, but will place R&D focus on peripheral driver ICs rather...
Telsa has announced that it will switch to lithium iron phosphate (LFP) batteries for its standard range Model S, 3, X and Y EVs, but will continue to use nickel cobalt manganese...
The supply of leadframes for chip packaging has been tight, with the visibility of orders from international IDMs for automotive and industrial applications extended to 2023, according...
Taiwan-based leadframe makers Shuen Der Industry (SDI) and Jih Lin Technology are optimistic about shipments for automotive power components and modules over the next two to three...
China-based OSATs including JCET, Tongfu Microelectronics and Tianshui Huatain Technology have all moved to enhance their QFN (quad flat no-lead) packaging capability for automotive...
Production costs for third-generation semiconductor SiC and GaN devices are expected to gradually drop to roughly the same levels as silicon-based components in the next 3-5 years,...