Toshiba's semiconductor and electronic components subsidiary, Toshiba Electronic Devices & Storage, has reached a basic agreement with China's silicon carbide (SiC) wafer manufacturer...

China's SiC industry faces oversupply as 6-inch substrate prices plunge, prompting a strategic pivot to 8-inch wafers

Dr. Shang Y. Hou, Director of TSMC's High Performance Packaging Integration Division, delivered a keynote at the OCP APAC Summit 2025. He showcased how the chipmaker is combining its...

Below are the top DIGITIMES Asia stories from Aug 4 to Aug 10, 2025. The top three topics include 'China for China' drives Western chipmakers' strategy, Xiaomi releases open-source...

Taiwan-based materials analysis specialist Msscorps reported consolidated revenue of NT$545 million (US$18.24 million) for the second quarter of 2025, up 17.25% from the previous quarter...