Malaysia's IC design firm Oppstar has entered into two MoUs with Inventec to collaborate on next-generation AI chips and form a joint venture (JV), according to documents filed with...
Broadcom CEO Hock Tan revealed the company has landed a US$10 billion order from a mystery customer, which insiders now identify as OpenAI. The two firms are developing OpenAI's first...
Japanese chemical and materials company Resonac announced on September 3, 2025, the formation of a new industry alliance named JOINT3, comprising 28 domestic and international semiconductor-related...
In early 2025, a leading Chinese third-category silicon carbide (SiC) substrate manufacturer faced international IDM customer complaints over product quality, triggering market concerns...
TSMC has surpassed Intel in the number of US patent applications for silicon photonics (SiPh), a crucial optoelectronic integration technology essential for artificial intelligence...
As AI chips advance, managing their high thermal output has become a key performance bottleneck. Semiconductor suppliers recently indicated that the advanced packaging sector is considering...
