Samsung Electronics has reportedly failed its third attempt at obtaining Nvidia's certification for 12-layer HBM3E chips in June 2025, according to a recent report by a Hong Kong brokerage...
SK Hynix is approaching the final delivery deadline for its May orders of thermal compression bonding (TCB) equipment from Hanmi Semiconductor and Hanwha Semitech, as the industry...
SK Hynix Inc. (or "the company", www.skHynix.com) announced today that it presented a new DRAM technology roadmap for the next 30 years and the direction for a sustainable innovation...
European financial securities firm UBS recently released a report indicating that Samsung Electronics' anticipated 12-layer HBM3E, originally expected by June 2025, may not be ready...
As Lee Jae-myung takes office as South Korea's 21st President, the global tech and industry community is closely monitoring his ambitious economic agenda. Among the key sectors under...
South Korea's newly elected President Lee Jae-myung has unveiled a flagship policy offering up to 10% production tax credits for semiconductors manufactured and sold domestically,...
China's CXMT is accelerating its development of high-bandwidth memory (HBM) and DDR5 chips, mounting a direct challenge to the global DRAM dominance of Samsung Electronics and SK Hynix...
Micron Technology has begun mass production of its 1γ-based LPDDR5X memory, outpacing rivals Samsung Electronics and SK Hynix in the race to supply faster, low-power DRAM for...
South Korea's semiconductor giants, Samsung Electronics and SK Hynix, are ramping up the adoption of artificial intelligence (AI)-driven electronic design automation (EDA) to bolster...
The global HBM market is undergoing a seismic shift, propelled by surging demand for AI and high-performance computing. South Korea's memory heavyweights—Samsung Electronics...
