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    Automotive display growth shifts to HUDs, passenger screens
    15min ago
    LG Electronics, Microsoft enter partnership on AI data centers, physical AI
    24min ago
    Samsung Display explores halftone black PDL tech to cut OLED production costs
    31min ago
    Samsung LPDDR6 validated by Qualcomm for next-gen Snapdragon platform
    35min ago
    Qualcomm and Google eye Agentic AI, expand partnership to GoogleBook, automotives
    42min ago
    Biwin Storage commits US$672M to double down on 2.5D packaging, compute-memory integration
    46min ago
    NEWS TAGGED SOIC
    Tuesday 22 September 2026
    GUC Announces 2nm 16 Gbps HBM4E IP

    Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced that its HBM4E PHY and Controller IP is design-ready and has been adopted in customer AI ASICs....

    Friday 14 August 2026
    Nvidia Feynman pushes TSMC A16 and CPO ramp

    Nvidia is accelerating development and supply-chain alignment for its Feynman generation in the second half of 2028, even as Vera Rubin...

    Tuesday 11 August 2026
    OCP APAC 2026: TSMC tackles CoWoS material risks while cutting 3DIC development cycle to one year
    AI computing demand is rapidly increasing the complexity of chip integration, shifting advanced packaging competition beyond individual component performance to reliability and validation...
    Monday 1 June 2026
    Exclusive: TSMC SoIC deepens AI chipmaker lock-in while Huawei hits process wall
    The global semiconductor industry is at an inflection point, split between those who can still shrink transistors and those who can no longer do so. US export controls and the denial...
    Thursday 14 May 2026
    TSMC expands CoWoS and SoIC capacity on AI boom
    TSMC said on May 14, 2026, that it is rapidly expanding CoWoS and SoIC advanced packaging capacity as AI demand drives the construction of 18 new fabs and advanced packaging facilities...
    Monday 12 January 2026
    TSMC expands advanced packaging, reportedly set to name first 'general plant manager'
    TSMC is rapidly expanding its advanced packaging operations and is reportedly poised to appoint its first-ever "general plant manager" to oversee all facilities. The role is expected...
    Monday 3 November 2025
    AI chip packaging complexity drives surge in equipment orders
    TSMC is accelerating development beyond the 2nm process node while expanding mass production of CoWoS-L, SoIC, and next-gen WMCM and CoPoS technologies. The semiconductor industry...
    Tuesday 9 September 2025
    Five years on, Taiwan's G2C positions local equipment makers at center of AI packaging shift
    Soaring demand for AI computing is ushering the semiconductor sector into a fresh cycle of high-speed growth, pushing advanced packaging requirements to new heights. From infrastructure...
    Friday 15 August 2025
    Exclusive: TSMC primes CoPoS supplier network for Chiayi, US fabs ahead of 2028 ramp
    TSMC is pushing its advanced packaging roadmap beyond its CoWoS platform and the wafer-level multi-chip module (WMCM) — an enhanced InFO-PoP due in 2026 — with a new integration...
    Friday 18 July 2025
    InPsytech finalizes UCIe 2.0 compliant SoIC design for 3D heterogeneous integration
    InPsytech, a leading company under the Egis Technology Group specializing in high-speed semiconductor IP solutions, has completed its advanced design for TSMC's Face-to-Face (F2F)...
    Monday 23 June 2025
    TSMC advanced packaging gains traction with Apple, Nvidia orders
    Advanced packaging continues to gain momentum, with the industry closely watching as TSMC not only secures large orders from Nvidia but also sees Apple joining the fray, clearly signaling...
    Monday 7 April 2025
    PVI expands production capacity, expects 40% revenue growth in 2025
    As a leader in advanced processes and the CoWoS and SoIC advanced packaging supply chain, Praise Victor Industrial (PVI) is benefited from the ongoing semiconductor expansion wave,...
    Thursday 21 November 2024
    TSMC quietly forms advanced packaging supply chain cluster in Southern Taiwan
    TSMC is strategically developing a dedicated supply chain cluster on 30 hectares (300,000 square meters) of land in Southern Taiwan Science Park (STSP) to strengthen its advanced packaging...
    Thursday 3 October 2024
    TSMC's backend equipment suppliers benefit from AI chip demand
    Strong AI chip demand has led to full utilization of TSMC's fab capacity, benefiting related suppliers such as Siliconware Precision Industries (SPIL) and equipment manufacturers like...
    Tuesday 24 September 2024
    TSMC SoIC fab capacity to reportedly boost through to 2026
    The AI surge requires TSMC to swiftly expand its production capacity for chip-on-wafer-on-substrate (CoWoS) packaging. Simultaneously, the foundry's production capacity for 3D-stacked...
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    GlobalExhibition
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    Sep 23, 08:00
    The Robot in the Supply Chain
    Tuesday 22 September 2026
    Macronix Secure Memories Build Hardware Defenses for EU CRA
    Tuesday 22 September 2026
    GUC Announces 2nm 16 Gbps HBM4E IP
    Tuesday 22 September 2026
    AI Drones Advance Industrial Inspection, Suntek Unlocks New Market Opportunities
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