CONNECT WITH US
NEWS TAGGED SOIC
Wednesday 31 August 2022
TSMC to boost advanced packaging capacity by 2026
TSMC expects to scale up its advanced packaging production capacity in 2022, which will be 300% greater than that in 2018, and to further boost the output by 2026 thanks to the commercialization...
filusch fiore kommunikations.design GmbH
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research