MJC Probe (MPI) has announced its board of directors recently approved plans to withdraw from the solar ingot slicing business, in which it began operations in mid-2007. The move...
Solar-grade wafer maker Green Energy Technology (GET) announced that its Shandong, China-based subsidiary Ultra Energy (Weifang) Technology will begin volume production of solar-grade...
Sino-American Silicon Products (SAS) and Green Energy Technology (GET) have introduced diamond square, a new ingot slicing process that can increase wafer output 30-40% compared to...
China-based solar ingot/wafer supplier Solargiga Energy on March 18 published its 2009 financial report, posting revenues of 658 million yuan (US$96.3 million), gross margin of 25.3%...
Prices of China-made silicon carbide (SiC), a material used in slicing solar-grade silicon ingots, have increased by 10% to NT$140-200 (US$4.4-6.3)/kg, according to sources with Taiwan-based...
Green Energy Technology (GET), a Taiwan-based maker of solar-grade crystalline silicon ingots and wafers, expects to ship an equivalent of 230MWp in wafers during the first half of...
Taiwan-based solar wafer maker Green Energy Technology (GET) on January 7 announced the cancellation of a plan to issue 5-year unsecured euro convertible bonds (ECBs) worth up to...
Probe card maker MJC Probe's (MPI's) book-to-bill (B/B) ratio of probe cards used in LCD driver IC manufacturing reached 1.2 in November, the highest level in 2009, thanks to inventory...
Taiwan-based solar ingot and wafer supplier Danen Technology saw record revenues of NT$133 million (US$4.1 million) in October and expects its fourth-quarter revenues to also reach...
MJC Probe (MPI) has estimated its fourth-quarter probe card shipments will stay flat or decline by 5-10% due to decreased orders from LCD driver IC customers, but demand for handset...
Green Energy Technology (GET), a Taiwan-based producer of solar-grade polycrystalline silicon (poly-Si) ingots and wafers, will expand its annual capacity of ingot growing and wafer...
Green Energy Technology (GET), a Taiwan-based maker of solar-grade polycrystalline silicon (poly-Si) ingots and wafers, will soon expand its annual capacity of ingot slicing from...
Danen Technology will expand its annual ingot slicing capacity from 35MWp to 50-60MWp at the end of 2009. Ingot growing capacity will also expand from 60MWp to 120MWp in the first...
Green Energy Technology (GET) has recently moved to temporarily outsource wafer slicing because its own capacity is unable to meet a recent large increase in order volumes, according...
Green Energy Technology will begin to use self-developed technology to increase the total production capacity of is silicon ingot growing equipment from an equivalent of 200MWp to...
