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Thursday 11 July 2024
Canadian robotic company Mecademic sees 50% CAGR in Asia-Pacific automation markets
Mecademic Industrial Robotics, a leader in micro-automation, is set to expand its presence in the high-growth medical devices and electronics markets, particularly in the Asia-Pacific...
Thursday 11 July 2024
Samsung first-ever major strike threatens chip ambitions as union asserts its influence
Samsung Electronics' largest union, the "National Samsung Electronics Union," began a general strike on July 8, 2024, and announced an indefinite two-phase strike on July 10. This...
Wednesday 10 July 2024
Samsung and SK Hynix set to introduce new HBM wafer debonding technology
Samsung Electronics and SK Hynix are investing in R&D of new process technologies to prevent warpage in next-generation high-bandwidth memory (HBM). This move is anticipated to...
Wednesday 10 July 2024
Chinese and South Korean SiC tool makers make efforts to cut dependence on Aixtron
In the 2024 SiC Semiconductor Conference held in Pusan in late June 2024, Chinese and South Korean fab tool makers announced SiC MOCVD-related technologies, trying to challenge the...
Wednesday 10 July 2024
Samsung reportedly adopts Mo in 3D NAND, to reshape memory industry
Samsung Electronics is reportedly adopting Molybdenum (Mo) for the metal wiring process in its ninth-generation 3D NAND (V9 NAND) technology.
Wednesday 10 July 2024
Battery maker SK On strives to stem losses
The prospect of South Korean battery maker SK On returning to profitability anytime soon looks dim, judging from the uncertainty in the market, according to industry sources.
Tuesday 9 July 2024
Samsung develops FOWLP-HPB packaging solution to curb mobile AP overheating
Samsung Electronics is reportedly developing a new packaging technology to address the overheating of mobile application processors (APs), which may be applied to its next-generation...
Monday 8 July 2024
Samsung establishes HBM development team as first major change under new DS division head
Under the guidance of newly appointed head Young Hyun-Jun, Samsung Electronics' Semiconductor and Device Solutions (DS) division is reportedly enhancing its competitiveness in high-bandwidth...
Monday 8 July 2024
Taiwanese PA chip makers see strong demand from China and US
As the smartphone industry enters its peak shipment season in the second half of 2024, major brands are launching new devices. Taiwan's power amplifier (PA) chip supply chains, including...
Monday 8 July 2024
Samsung plans to adjust automotive chip business to focus on AI chips
To concentrate more on its AI chip business, Samsung Electronics has reportedly decided to adjust the development pace of its "Exynos Auto" automotive chip project, which has been...
Friday 5 July 2024
Japan, South Korea race to develop GCS for next-gen chip packaging amid Intel push
Glass core substrates (GCS) are poised to play a crucial role in next-generation advanced chip packaging. In response, Japanese and South Korean semiconductor supply chain players...
Friday 5 July 2024
SK Hynix converts part of M10 production lines to produce HBM products
SK Hynix is reportedly converting part of its production line at its Icheon semiconductor plant in South Korea to manufacture high bandwidth memory (HBM) in response to rapidly increasing...
Friday 5 July 2024
Samsung expected to achieve 14-fold surge in operating income amid memory business recovery
Samsung Electronics is poised to report impressive results for the second quarter of 2024, driven by a recovery in the semiconductor industry. The company's operating profit surpassed...
Friday 5 July 2024
Samsung pivots to AI chip development amid major semiconductor division reorganization and talent acquisition drive
Samsung Electronics is reportedly shifting its focus from automotive chip development to AI chips amid plans for significant business reorganization. This strategic pivot comes as...
Friday 5 July 2024
South Korean 8-inch wafer foundry to engage in SiC and GaN business
South Korean 8-inch wafer foundries are accelerating their investments in next-gen power semiconductors. Facing fierce competition from established global manufacturers and Chinese...