STATS ChipPAC, a Singapore-based semiconductor packaging and testing service provider, has announced a new flip-chip (FC) technology that it says offers cost savings over standard...
STATS ChipPAC has posted its second straight quarterly loss in the first quarter of 2009, joining fellow packaging and testing house Advanced Semiconductor Engineering (ASE). Its...
Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have recently seen more orders shifted from Amkor Technology, STATS ChipPAC Taiwan Semiconductor...
Wafer testing service providers Ardentec, King Yuan Electronics Company (KYEC) and STATS ChipPAC Taiwan Semiconductor have estimated stronger performance for the second quarter of...
With Amkor Technology recently revising up its gross margin outlook for the first quarter and indicating that its revenues will fall into the avorable end of the range of the company's...
Most Taiwan-based wafer testing companies, including King Yuan Electronics (KYEC), Ardentec and STATS ChipPAC Taiwan Semiconductor, expect March revenues to perform better than those...
Advanced Semiconductor Engineering (ASE) has estimated that its sales in the first quarter of 2009 may drop 35-40% sequentially amid a continuing dim outlook. The wafer packaging...
Singapore's STATS ChipPAC has posted sales of US$324.6 million for the fourth quarter of 2008, down 31.3% sequentially and 31.9% from 2007. For the full year 2008, the packaging and...
With Advanced Semiconductor Engineering (ASE) lowering its fourth-quarter guidance closely on the heels of a grimmer outlook offered by Taiwan Semiconductor Manufacturing Company...
STMicroelectronics, STATS ChipPAC and Infineon Technologies announced that they have signed an agreement to jointly develop next-generation embedded wafer-level ball-grid array (eWLB)...
Despite second-quarter performance that failed to meet expectations, major IC testing houses in Taiwan foresee a demand pickup alongside seasonality in the third quarter.
