Prices of TDDI (touch with display driver integration) chips are under continued downward pressure, as competition in the sector is heating up due to capacity ramps by related IC...
Huawei's IC orders for its new smartphone models to be released in the second half of 2019 are to pick up again soon thanks to an easing of the US trade ban against the top Chinese...
Taiwan's handset TDDI IC supply chain for Huawei, including designers, backend COF service providers and substrate suppliers, have turned guardedly optimistic about their business...
Chipbond Technology will put on hold its 5G PA (power amplifier) packaging capacity expansion originally set to be enforced in the second half of 2019, due mainly to the uncertainties...
Taiwan IC designers have turned conservative about their revenue performances for the second half of 2019 as uncertain fallouts of the US-China trade war and trade sanctions against...
Huawei has reportedly promised not to cut its orders with Taiwan's upstream and downstream supply chain partners and also inquired about the possibility of increasing their production...
China's largest telecom equipment maker Huawei and its chipmaking arm HiSilicon are ambitiously proceeding with their vertical and horizontal deployments in diverse chip solutions...
Fabless chipmaker Himax Technologies expects to post a revenue increase of 2-7% sequentially in the second quarter following a 14.5% drop in the first quarter. Gross margin is forecast...
LCD driver IC design specialist Novatek Microelectronics expects shipments of its high-ASP and high-margin TDDI (touch and display driver integration) chips to top 20 million units...
Taiwan-based IC design houses have seen orders for Android smartphones pick up in the second quarter, thanks mainly to the upcoming rollouts of new models, according to industry so...
Taiwan-based IC designer FocalTech Systems is likely to return to profitability in 2019 thanks to robust shipments of its new-generation TDDI and fingerprint ID chip solutions expected...
Backend houses have seen orders for handset-use TDDI (touch and display driver integration) chips ramp up significantly, prompting them to allocate part of their COF (chip on film)...
COG (chip-on-glass) packaging demand has picked up recently as some Taiwan-based suppliers of TDDI (touch and display driver integrated) chips adopt the method to replace COF (chip-on-film)...
Global shipments of smartphone-use TDDI (touch and display driver integration) chips are expected to increase 20% in 2019 from about 414 million units in 2018, according to Digitimes...
Touch and fingerprint sensor supplier Elan Microelectronics is expected to suffer a 10% sequential decline in revenues in the first quarter due to fewer working days during the Lunar...
