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Monday 30 January 2023
Onsemi, Volkswagen team up for EV inverters
Onsemi has signed a strategic agreement with German automaker Volkswagen (VW) to provide modules and semiconductors that enable a complete electric vehicle (EV) traction inverter...
Thursday 19 January 2023
Memory module vendor Team Group to return to growth track in 2023
Taiwan's memory module and SSD vendor Team Group is optimistic that its revenues will return to a growth track in 2023, expecting annual sales for the year to grow 23% on year to...
Thursday 12 January 2023
Actron, Excelliance MOS to team up for automotive diodes and MOSFETs
Automotive diode specialist Actron Technology has made an equity investment in MOSFET supplier Excelliance MOS, as part of their planned collaboration in the automotive power device...
Wednesday 4 January 2023
Nvidia, Foxconn team up for autonomous vehicles
Nvidia has announced it is teaming up with Hon Hai Precision Industry (Foxconn) to develop solutions for autonomous vehicles.
Wednesday 4 January 2023
Richtek and EPC team up to create small 140-watt fast-charging solution
Richtek, the global leading analog IC design company has teamed up with EPC, the leading provider of gallium nitride (GaN)-based power management technology to launch a new reference...
Wednesday 28 December 2022
Novatek, Himax team up for AI chips
Himax Technologies has announced it is teaming up with fellow display driver IC company Novatek Microelectronics to develop pre-roll AI solutions for battery-operated surveillance...
Friday 23 December 2022
Wistron reshuffles management team
Wistron has decided to reshuffle its management, with Jeff Lin to become president and CEO.
Monday 19 December 2022
EDOM in help to create world's first true MEMS hearing aid using xMEMS silicon-micro speakers at CES 2023 in US
The world's first hearing aid equipped with xMEMS solid-state speakers is coming soon! This hearing aid adopts the xMEMS Labs True MEMS speaker "Montara" represented by EDOM Technology,...
Wednesday 14 December 2022
Samsung plans to add EUV team to Taylor site ahead of schedule to compete with TSMC
Samsung Electronics seems to be speeding up its efforts to fight back against TSMC in the US. Recently, it's been actively recruiting EUV talent, hoping to establish the EUV engineering...
Wednesday 14 December 2022
NXP, Delta team up for next-gen EV solutions
NXP Semiconductors and Taiwan's Delta Electronics, a switching power supply provider, have struck a deal under which the pair will jointly develop next-generation electric vehicle...
Tuesday 13 December 2022
Samsung adjusts semiconductor department for advanced packaging ambition
Samsung Electronics's Device Solutions (DS) division recently adjusted its organization by adding an advanced packaging team under the Test & System Package (TSP) department,...
Monday 12 December 2022
Ennostar's subsidiary joins LEO satellite national team, will provide key RF chips
Ennostar announced that its subsidiary Hexawave has joined the "Beyond 5G LEO (low-Earth orbit) satellite project" launched by Taiwan's Ministry of Economic Affairs (MOEA) and will...
Wednesday 7 December 2022
Taiwan government to deploy team to protect key technologies
With the concern that the US may pressure the Taiwanese government to have TSMC move its newest technologies to the US, thus weakening Taiwan's importance in the semiconductor industry,...
Wednesday 16 November 2022
Rohm to team up with Shenzhen chipmaker for SiC power devices
Rohm Semiconductor has struck a strategic cooperation agreement with China's Shenzhen-based BASiC Semiconductor under which the pair will jointly develop SiC power devices for electric...
Friday 30 September 2022
J&V Energy Technology organizes Taiwan Team 2.0 for developing offshore wind farms
Renewable energy developer J&V Energy Technology has organized a team, dubbed Taiwan Team 2.0, specifically for joint participation in developing offshore wind farms in the third...
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Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research