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Monday 24 January 2022
Foxconn, Gogoro, IBC and Indika team up for new energy ecosystem project in Indonesia
Hon Hai Technology Group (Foxconn), a global leader in smart manufacturing, has signed an MoU with the Indonesian Ministry of Investment/BKPM, IBC, Indika, and Gogoro to jointly develop...
Wednesday 19 January 2022
Freyr, Aleees team up for LFP cathode manufacturing
Norway-based Freyr Battery, a startup specializing in lithium-ion battery cells, and Taiwan-based Aleees, a producer of lithium iron phosphate (LFP) cathode materials for batteries,...
Friday 19 November 2021
AMD, MediaTek teaming up
AMD and MediaTek have jointly announced a collaboration to co-engineer industry-leading Wi-Fi solutions, starting with the AMD RZ600 series Wi-Fi 6E modules containing MediaTek's...
Wednesday 17 November 2021
Qualcomm, BMW team up for automated driving
Qualcomm has announced a collaboration to bring the latest advancements in driver assistance technologies and products of its Snapdragon Ride Platform to BMW Group's next generation...
Tuesday 12 October 2021
Utilizing power of data to enhance corporate efficiency, Taiwan Tech's team demonstrates value of data with precision
With the advent of the AI era, big data analysis has become the crucial technology for upgrades in various industries. However, physical equipment and online websites in both factory...
Friday 17 September 2021
Highlights of the day: International EV and semiconductor makers team up for SiC modules
Following in the footsteps of International IDMs and automakers to promote their SiC components for EVs, China auto and...
Thursday 16 September 2021
GF, Qualcomm team up for advanced 5G RF front-end devices
GlobalFoundries (GF) has announced the foundry is continuing its partnership with Qualcomm, expanding their RF collaboration on 5G multi-Gigabit speed RF front-end products.
Friday 10 September 2021
Memory price growth to lose momentum in 4Q21, says Team Group
Memory price growth is poised to lose momentum in the fourth quarter of 2021, as chip suppliers, and downstream distributors and module houses see their deliveries disrupted by the...
Friday 20 August 2021
DRAM contract prices likely to drop 5-10% in 4Q21, says Team Group
DRAM contract prices are likely to fall 5-10% in the fourth quarter of 2021, and continue their slight drops through the second quarter of next year, according to CW Chen, president...
Wednesday 11 August 2021
Taiwan government and enterprises should team up for talent cultivation, says Etron chair
Built upon its solid foundation, Taiwan's semiconductor industry is gearing up for its next stage of development. A shortage of engineers and other professionals remains a challenge...
Wednesday 7 July 2021
Swancor forms Taiwan team for developing offshore wind farms
Swancor Renewable Energy has disclosed it has partnered with Tien Li Offshore Wind Technology, Yeong Guan Energy Technology and J&V Energy Technology to form a Taiwan team for...
Wednesday 9 June 2021
Tokyo Electron to collaborate with imec-ASML joint high NA lab
Tokyo Electron has announced the company will introduce its leading-edge Coater/Developer to the imec-ASML joint high NA EUV research laboratory (joint high NA lab) in Veldhoven,...
Wednesday 2 June 2021
US, France healthcare startups team up with Taiwan to drive growth in Asia
As COVID-19 continues to hamper international interactions, two startups from the US and France collaborating with BE Health in Taiwan have closed venture capital funding rounds recently...
Thursday 1 April 2021
Himax, BOEVx team up for automotive AMOLED display solutions
Himax Technologies, a vendor of driver ICs, has announced it has teamed up with BOE Varitronix (BOEVx), a supplier of car-use display products, to develop flexible AMOLED automotive...
Thursday 1 April 2021
Team Group posts profit hike on record revenue in 2020
Memory module house Team Group saw its net profit jump more than tenfold on year to NT$141 million (US$5 million) in 2020, with revenue hitting a record high of NT$7.5 billion. EPS...