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Friday 16 September 2022
ASE, TSMC team up for silicon photonics
ASE Technology is partnering with TSMC on the development of silicon photonics (SiPh), and has cut into the supply chain of Tier-1 chip vendors for co-packaged optics (CPO) products,...
Thursday 15 September 2022
Delta, SAS to team up for 3rd-gen semiconductors
Delta Electronics through its affiliate Ancora Semiconductors, which focuses on GaN technology, will be teaming up with Sino-American Silicon (SAS) in the third-generation semiconductor...
Wednesday 7 September 2022
Rohm, Nanjing SemiDrive team up for automotive solutions
Rohm Semiconductor has announced that it is partnering with SemiDrive Technology, a China-based SoC manufacturer of next-generation cockpits, to develop automotive solutions. The...
Wednesday 31 August 2022
VicOne, Delta team up for EV charging infrastructure cybersecurity
VicOne, an automotive cybersecurity solution provider wholly owned by Trend Micro, has partnered with Delta Electronics to secure EV charging infrastructure, which will help the latter's...
Thursday 25 August 2022
Cadence, UMC team up for 22nm analog and mixed-signal IC design flow certification
Cadence Design Systems' analog and mixed-signal (AMS) IC design flow has been certified for United Microelectronics' (UMC) 22ULP/ULL process technologies, according to the companies...
Monday 15 August 2022
Memory module firm Team Group reports loss in 2Q22
Memory module house Team Group swung to losses in the second quarter but remained profitable in the first half of 2022.
Friday 5 August 2022
NXP, Inventec team up for automotive electronics ecosystem in Taiwan
Automotive IC vendor NXP Semiconductors and ODM Inventec have announced they are teaming up to create an industry ecosystem locally in Taiwan for automotive electronics products.
Thursday 21 July 2022
Foxconn, NXP team up for EVs
NXP Semiconductors has signed a memorandum of understanding (MOU) with Hon Hai Technology Group (Foxconn) to jointly develop platforms for a new generation of smart connected vehicles,...
Tuesday 12 July 2022
ST, GF team up for 300mm wafer fab in France
STMicroelectronics and GlobalFoundries have signed a MoU to build a 300mm semiconductor manufacturing facility in France, according to the chipmakers.
Friday 1 July 2022
CHT, AWS team up to help Taiwan clients improve data governance
Taiwan's top telecom operator Chunghwa Telecom (CHT) has newly incorporated data governance architecture G@S (Governance@Scale) provided by Amazon Web Services (AWS) to help clients...
Monday 27 June 2022
Microsoft Taiwan forms team to help local makers cut carbon emissions
Microsoft Taiwan has established a Taiwan ICT Sustainability Green Team in a bid to help local manufacturers realize carbon reductions.
Friday 29 April 2022
Rohm, Delta team up for GaN power devices
Rohm Semiconductor and Delta Electronics have entered into a strategic partnership to develop and mass produce next-generation gallium nitride (GaN) power devices, according to the...
Wednesday 27 April 2022
Denso, USJC team up for automotive power semiconductors
Denso and United Semiconductor Japan (USJC), a subsidiary of Taiwan-based United Microelectronics (UMC), have announced they will partner to manufacture automotive power semiconduc...
Friday 8 April 2022
Leadframe makers, IDMs team up to serve major EV vendors
Taiwan's major leadframe makers including Jih Lin Technology and SDI are joining forces with international IDMs to supply customized power modules to Tesla and other first-tier EV...
Monday 14 February 2022
Case study: How virtual leaders manage a successful virtual team
Geographically dispersed teams are increasingly common in the modern workplace. Perhaps you are based in your company's US headquarters, but your team works in Brisbane, and you also...