As the number of DRAM stacks in high bandwidth memory (HBM) increases, there will be new developments in Through-Silicon Via (TSV) materials, focus rings and debonding technology...
Taiwan's National Science and Technology Council (NSTC) is betting big on sports technology as a key driver of economic growth. The council aims to cultivate a robust industry capable...
Smartphones are increasingly using AMOLED panels and in the first quarter of 2024, the overall shipment volume of AMOLED panels surpassed TFT LCD panels for the first time, making...
Tesla's net profit fell by 45% YoY in the second quarter of 2024 to US$1.48 billion, which may indicate that the company is facing challenges with its transformation, according to...
The Japanese yen's depreciation will provide Japan-based ABF substrate companies with an additional advantage over their Taiwanese counterparts, in addition to technology leadership,...
The booming development of AI applications is accelerating the advancement of IC process production, with fabless chipmakers also upgrading manufacturing specifications for their...
Celebrating the 50th anniversary of Hon Hai Corporation, Hon Hai Research Institute held the AI NExT Forum with the theme of "50 Years-New Era of Wisdom: Generative AI and Future...
AI startup Tenstorrent, led by chip industry veteran Jim Keller as CEO, recently announced a new generation of AI hardware featuring the Wormhole Tensix processor equipped with RISC-V...
Powertech Technology (PTI) is currently developing fan-out panel-level packaging (FOPLP) and seeking collaboration with fabless chip vendors, according to the Taiwan-based memory...
South Korea's imports of panel manufacturing equipment soared tenfold in the first half of 2024 compared to the same period in 2023, reaching approximately US$315 million. This dramatic...
Sharp has made a strategic move to enhance its mobile device wireless communication technology by acquiring communication patents from Foxconn. This acquisition aims to strengthen...
E Ink Holdings (E Ink), a leading e-paper company, is aggressively advancing its color e-paper products. In consumer applications, demand for e-readers and e-paper notebooks remains...
The shortage of talent in the semiconductor industry is no longer news. Still, the continuous growth in demand for advanced packaging has triggered a mid-to-long-term scarcity of...
Glass substrates are recognized as critical materials for next-generation advanced semiconductor packaging technologies needed to support the explosive growth of AI chips.
Glass substrates have become a critical strategic element in fan-out panel level packaging (FOPLP), a technology that TSMC and various backend houses are developing. Because of that,...
