Taiwan Perovskite Solar Corp. (TPSC) has invested more than NT$200 million (US$6.3 million) to build Taiwan's first carbon-free perovskite plant, which has delivered the first batch...
In a significant leap forward for semiconductor manufacturing, ifm, a global leader in sensor technology, exhibited a comprehensive suite of smart sensing solutions at SEMICON Taiwan...
Panel-level packaging (PLP) is promising to become a viable choice due to its cost-effectiveness and insufficient capacity for advanced chip packaging in the semiconductor industry...
In recent years, advanced packaging has become increasingly crucial in high-performance computing, and Chinese OSAT companies, particularly Tongfu Microelectronics, are determined...
Samsung Electronics attended Gamescom 2024, held in Cologne, Germany. With an alleged largest-ever exhibition hall of about 800 square meters, Samsung unveiled its new gaming monitor,...
The semiconductor industry is experiencing a surge in demand for advanced packaging technologies, driven by the rapid growth of high-end AI servers and generative AI. This trend has...
JCET, a leading Chinese semiconductor packaging and testing services provider, has announced impressive financial performance for the first half of 2024. The company reported a significant...
Despite a recent downturn in the overall automotive market, suppliers of automotive components have reported a rise in revenue. This trend is particularly pronounced in the automotive...
Mitsubishi Materials has announced the development of the world's largest rectangular silicon substrate, a technology gaining attention due to advancements in advanced packaging....
As the world enters the AI era for mobile devices, Samsung Display (SDC) and LG Display (LGD) both express optimism about the outlook of OLED technology. According to Lee...
Apollo Go, developed by Baidu, has been making significant strides in the autonomous vehicle industry, particularly following its operation in Wuhan, China, which brings the concept...
