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Tuesday 2 September 2025
Taiwan's 6G future hinges on spectrum policy as Nokia awaits regulatory direction
Sixth-generation wireless technology is expected to launch commercially around 2030, prompting global telecom operators to accelerate early preparations. Nokia has begun frequency...
Monday 1 September 2025
TPCA Show to kick off in October with Unimicron chair as keynote speaker
The technology supply chain will gather for a series of exhibitions in the second half of 2025, including Taiwan's major PCB industry event, the TPCA Show, which will take place from...
Monday 1 September 2025
Taiwan's auto testing sector anchored in exports, resilient to US 'spec-for-tariff' deal
The United States is in talks with the European Union, Japan, and other countries on a proposed "spec-for-tariff" agreement, which would allow US-made vehicles to bypass costly redesigns...
Monday 1 September 2025
US weighs BOE OLED ban, putting Apple's display supply chain in flux
The US is reportedly moving to impose a long-term sales ban on OLED panels made by China's BOE Technology, raising the prospect of a significant reshuffle in Apple's display supply...
Monday 1 September 2025
Nokia pushes 5G-Advanced as gateway to 6G, spotlights AI's growing role in networks
As 5G continues to proliferate worldwide, major telecom equipment makers are accelerating efforts toward next-generation communications. Nokia has already begun 6G frequency band testing...
Saturday 30 August 2025
TSMC supplier AMC rewires its future with warpage-control materials after LCD collapse

Taiwan's LCD panel industry, which peaked at over NT$1 trillion in 2007, collapsed within years and became unprofitable. The decline pushed...

Friday 29 August 2025
India-based boAt, HrdWyr unveil indigenously designed chip with Tata Electronics support
boAt has partnered with semiconductor startup HrdWyr to launch the HrdWyr Indus 1011, a high-volume chip fully designed in India, with assembly, packaging, and testing enabled by Tata...
Wednesday 27 August 2025
Nvidia's CoWoP PCB architecture targets ABF substrates but faces warpage risk
Nvidia's new advanced packaging technology, Chip-on-Wafer-on-Platform (CoWoP), has moved into testing with engineering samples of its base printed circuit boards (PCBs) under verification...