GT Advanced Technologies has announced that it has begun final production testing for its new DSS MonoCast ingot growth technology with South Korea-based PV manufacturer Nexolon....
A number of Taiwan-based semiconductor companies including foundries Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics Corporation (UMC), memory chipmakers...
The semiconductor industry is working through excessive inventory coupled with unusual slowness in the third quarter of 2011, which has caused the average capacity utilization rate...
First-tier notebook brand vendors Acer, Lenovo, Toshiba and Asustek Computer, understanding that demand for notebooks is unlikely to recover in the fourth quarter, while Apple's products...
Packaging and testing firm Siliconware Precision Industries (SPIL) is likely to snatch outsourcing orders for Apple's new processor dubbed A6, according to industry sources.
King Yuan Electronics (KYEC) and STATS ChipPAC Taiwan Semiconductor (SCT), providers of IC testing services, saw net profits for the second quarter of 2011 drop 52.0% and 31.0% seq...
The growing supply-demand imbalance in the PC DRAM market has discouraged packaging and testing firms from paying attention to the segment, with some looking to completely phase out...
Memory packaging and testing firms Powertech Technology (PTI) and Walton Advanced Engineering both expect their fourth-quarter revenues to be lower than the levels recorded in the...
Memory IC packaging and testing firm Walton Advanced Engineering has narrowed its sales forecast for the third quarter to flat growth sequentially, compared with the 0-5% increase...
The global semiconductor packaging and testing industry is likely to see less than 5% growth sequentially in the third quarter of 2011, affected by the transition from gold to copper...
Testing solution provider Chroma ATE saw its net profits grow 34% sequentially to NT$530 million (US$18.24 million) on consolidated revenues of NT$4.12 billion for the second quarter...
Packaging and testing house ChipMOS Technologies plans to gradually phase out its DRAM packaging and testing business, and concentrate on backend services for LCD driver ICs and flash...
IC packaging and testing house ChipMOS Technologies has signed an NT$8.4 billion (US$291 million) syndicated loan agreement with a banking consortium mostly to repay part of its previous...
Packaging and testing firm Powertech Technology (PTI) expects the development of new technologies including wafer-level packaging, 3D IC packaging and copper pillar bumping to bear...
