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Tuesday 6 January 2009
ASE buys back NT$315 million in shares
Advanced Semiconductor Engineering (ASE) has announced via a company filing with the Taiwan Stock Exchange (TSE) that the company has recently repurchased 30.857 million shares for...
Friday 12 December 2008
Chipbond to see losses for four straight quarters
Driver IC packaging and testing house Chipbond Technology's November sales were only NT$277 million (US$8.32 million), down 36% from October and lower than the company's breakeven...
Wednesday 3 December 2008
More players in packaging and testing sector may lower 4Q forecasts
With Advanced Semiconductor Engineering (ASE) lowering its fourth-quarter guidance closely on the heels of a grimmer outlook offered by Taiwan Semiconductor Manufacturing Company...
Monday 1 December 2008
KYEC postpones spin-off of memory testing division to January 2010
Logic IC testing house King Yuan Electronics Company (KYEC) has announced that a plan to spin off its memory testing division will be postponed to January 1, 2010 from the original...
Tuesday 18 November 2008
IC packaging and testing houses Sigurd and KYEC expects 10% drop in sales in 4Q
With the global semiconductor market falling on difficult times, IC packaging and testing houses Sigurd Microelectronics and King Yuan Electronics Company (KYEC) expect to see a 10%...
Monday 10 November 2008
Thailin Semiconductor to expand logic IC testing business
IC testing company Thailin Semiconductor has said that it will continue to expand its logic IC testing business with prospects adding one or two new clients in the first quarter of...
Wednesday 5 November 2008
Driver IC packaging and testing houses to see utilization drop to 55-66% in 4Q08
Driver IC packaging and testing houses Chipbond Technology, International Semiconductor Technology (IST), and ChipMOS Technologies will see their utilization rates drop to 55-60%...
Wednesday 22 October 2008
IC testing and LCD equipment vendors report declined profits for Jan-Sep period
Two leading Taiwan IC testing and LCD equipment suppliers Mirle Automation and Test Research (TRI) have seen a decline in profits for the first three quarters of 2008 due to weak...
Monday 20 October 2008
Global Testing CEO steps down on allegations of improper cash trading
Paul Yang, CEO of Singapore-listed wafer testing company Global Testing (GT) and president of its subsidiary GT Taiwan, has resigned amid allegations of improper cash dealings with...
Wednesday 15 October 2008
Wafer testing house Ardentec suspends expansion amid weak demand
Wafer testing service provider Ardentec is putting on hold its capital expenditure (capex) plans for the fourth quarter due to low order visibility, according to industry sources.
Tuesday 14 October 2008
Taiwan memory IC packaging and testing firms to benefit from Micron-Qimonda deal
Taiwan-based memory IC packaging and testing companies are likely to benefit from the Micron-Qimonda deal, according...
Thursday 9 October 2008
TSMC reportedly lands packaging and testing orders from CSR
Taiwan Semiconductor Manufacturing Company (TSMC) recently landed orders for wafer-level chip-scale packaging (WL-CSP) from Bluetooth chip maker CSR, according to market sources.
Tuesday 7 October 2008
3Q sales growth for packaging and testing companies, but sales should decline in 4Q
Taiwan packaging and testing companies performed better than expectation in general during the third quarter, but fourth-quarter sales are expected to decline sequentially, according...
Friday 3 October 2008
Taiwan IC testing company GT looks to support itself
With capital expenditures typically accounting for 60-70% of a testing company's total costs, companies such as Global Testing (GT) have pursued uniques strategies to minimize their...
Friday 3 October 2008
Commentary: Taiwan IC testing industry short-term rebound unlikely but sector continues to look to create opportunities
The IC testing industry is expected to see slow growth in 2008. However, instead of waiting for the economy to recover, industry players should rely on new products and technologies...
TPCA
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research