中文網
繁體
简体
SUBSCRIBE
My account
Sign in
Sign up
TECH
Tech Home
Semiconductors
Communications
ICT
Displays
Electric Vehicles
Sustainability
Aerospace
REGIONS
Asia Home
East Asia
Southeast Asia
South Asia
AsiaTech Frontier
RESEARCH
OPINIONS
Opinions Home
Interviews
Colley & Friends
Commentary
Research Insights
Column
FINANCE
BIZ FOCUS
Biz Focus Home
Trending Issues
COMPUTEX
SEMICON
CES
EVENT+
Event+ home
Featured Events
MULTIMEDIA
SUBSCRIBE
Trending
Intel
Nvidia
Meet the Analysts
Server EMS Tracker
Robotics Report
AI Server Report
SCMP Bundle
Trending
SUBSCRIBE
CONNECT WITH US
REALTIME NEWS
Kemflo International expands into activated carbon regeneration for semiconductor industry
Semiconductors
5min ago
Czech Minister of Research and Innovation visits Taiwan; NSTC highlights complementary technologies
Semiconductors
44min ago
Microsoft signs US$19.4 billion deal with Nebius amid surging AI cloud demands
ICT
54min ago
NEWS TAGGED THINKPAD EDGE
Tuesday 9 November 2010
Taiwan market: Lenovo launches 11.6-inch ThinkPad Edge 11
Lenovo has launched its latest 11.6-inch ThinkPad Edge 11 notebook in Taiwan targeting the small- to medium-business market.
Wednesday 3 February 2010
Taiwan market: Lenovo launches ThinkPad Edge
Lenovo has unveiled a new notebook series, the ThinkPad Edge to cover the gap between its enterprise-based ThinkPad series and consumer-based IdeaPad, according to Lenovo Taiwan.
BIZ FOCUS
Aug 5, 11:49
Cultivating OCP, embracing open source
Wednesday 3 September 2025
Tescan Unveils New Global Brand Platform 'The Art of Discovery' with APAC Rollout at SEMICON Taiwan
Wednesday 3 September 2025
Micraft System Plus Unveils Proprietary Thermo-Compression Bonder, Expands into Advanced Packaging Market
Wednesday 3 September 2025
SK hynix Introduces Industry's First Commercial High NA EUV
MOST-READ
7 DAYS NEWS
TSMC fine-tunes advanced packaging, delays projects, and trims low-return ops
Samsung-Nvidia CEO embrace hints at HBM4 deal amid Seoul's U$150B US pledge
TSMC to raise foundry prices by 5-10% across advanced nodes in 2026
Inside TSMC's 2nm leak involving TEL: How a job application became an international incident
CoWoP packaging takes on TSMC’s CoWoS, pressures CoPoS in AI chips
PBA released their latest nano-precision dual gantry stage platform series for heterogeneous semiconductor advanced packaging and metrology equipment
China's first open AI computing architecture: Sugon, Lenovo, Moore Threads come together to challenge Nvidia CUDA
CATL procurement staff visits South Korea, reportedly seeking key equipment and manufacturing technologies
Samsung's Exynos comeback aims for Qualcomm's mobile chip dominance
SpaceX to buy EchoStar spectrum licenses in US$17 billion deal
Full list
RESEARCH INSIGHTS
Intel signals overhaul of IDM 2.0 and foundry strategy with Lip-Bu Tan's appointment, says DIGITIMES
Members only
×
Sorry, the page you are trying to open is available only for our paid subscribers.
Please
login
to read more
New users, please
register
first