Some predictions suggest that as DRAM technology development is gradually approaching a bottleneck, hybrid bonding technology may be introduced into future DRAM manufacturing processes...

As TSMC and Intel announced in succession that they are conducting R&D for the back-side power delivery network (BSPDN) technology, Samsung Electronics recently shared the current...

After memory products like NAND Flash and DRAM, it's reported that Samsung Electronics will conduct R&D for a "3D stacking" technology that can vertically stack system semiconductor...