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NEWS TAGGED TSV
Tuesday 18 August 2020
Samsung announces silicon-proven 3D IC technology
Samsung Electronics has announced the immediate availability of its silicon-proven 3D IC packaging technology, eXtended-Cube (X-Cube), for today's most advanced process nodes.
Friday 3 January 2020
SJSemi strengthens presence in wafer-level 3D packaging segment
SJ Semiconductor (SJSemi), a joint venture between China-based foundry SMIC and backend house JCET, has started implementing its second-phase development looking to strengthen its...
Thursday 24 October 2019
China IC backend firms poised for strong 2020
China's top-3 IC backend houses Jiangsu Changjiang Electronics Technology (JCET), Tianshui Huatian Technology and Tongfu Microelectronics (TFME) have seen sales pick up in the second...
Monday 12 August 2019
SK Hynix develops HBM2E DRAM
SK Hynix has developed HBM2E DRAM product with what it calls the industry's highest bandwidth. The new HBM2E boasts approximately 50% higher bandwidth and 100% additional capacity...
Wednesday 14 March 2018
AMEC intros ICP etcher for advanced memory and logic IC designs
At the ongoing SEMICON China, Advanced Micro-Fabrication Equipment (AMEC) has unveiled its Primo nanova system - the company's first inductively coupled plasma (ICP) etcher for high-volume...
Wednesday 31 January 2018
PTI profits climb to 7-year high in 2017
Memory-IC backend specialist Powertech Technology (PTI) saw its net profits climb to a seven-year high of NT$5.85 billion (US$200.4 million) in 2017.
Friday 14 July 2017
Toshiba develops 3D flash memory with TSV technology
Toshiba has announced development of its BiCS flash three-dimensional (3D) flash memory utilizing through-silicon via (TSV) technology with 3-bit-per-cell (triple-level cell, TLC)...
Friday 2 June 2017
PTI optimistic about memory-dominated packaging
The era of memory-dominated packaging technology has arrived, and heterogeneous stacking with memory and logic devices has become a trend, according to DK Tsai, chairman and CEO for...
Monday 24 August 2015
TSMC stays neutral on ASE's bid for SPIL shares
TSMC would not comment on Advanced Semiconductor Engineering's (ASE) recently-announced bid to take up a major stake in Siliconware Precision (SPIL), according to the contract chip...
Tuesday 21 July 2015
UMC enters volume production for AMD chips using TSV
United Microelectronics (UMC) has entered volume production for AMD's graphics chips using through-silicon-via (TSV) technology, according to the Taiwan-based pure-play foundry.
Monday 25 November 2013
Amkor, Globalfoundries and Open-Silicon partner to develop SoC on 2.5D interposer
Amkor Technology, Globalfoundries and Open-Silicon have jointly announced the successful demonstration of a functional SoC featuring two 28nm logic chips with embedded ARM processors,...
Friday 12 April 2013
ASE breaks ground for new factory buildings in southern Taiwan
Semiconductor assembly and testing company Advanced Semiconductor Engineering (ASE) on April 12 held a groundbreaking ceremony for two new factory buildings, one designated for production...
Wednesday 3 April 2013
Globalfoundries demos 3D TSV capabilities on 20nm
Globalfoundries on April 2 announced the accomplishment of a key milestone in its strategy to enable 3D stacking of chips for next-generation mobile and consumer applications. At...
Thursday 6 September 2012
SPTS announces dry etch process technology for via reveal applications
SPTS Technologies has announced its dry etch process technology for via reveal applications. Already established as the tool of record at major customer sites, the Pegasus Rapier...
Thursday 6 September 2012
3D IC commercialization to take place in 2015-16, says ASE
The adoption and commercialization of 3D TSV stacking IC technology and products will likely take place in the 2015-16 timeframe, according to Tong Ho-ming, general manager and chief...
Vortex
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research