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NEWS TAGGED VAPOR CHAMBER
Tuesday 25 June 2024
CCI to begin mass production of 3D VC cooling for customers in 2H24
Amid the hype for liquid cooling in the server industry, Nidec Chaun-Choung Technology (CCI) chairman Junichi Nagai notes that the company will release liquid cooling solutions for...
Thursday 28 March 2024
IC packaging materials distributor Niching sees brisk order visibility
Niching Industrial has observed clear order visibility for vapor chambers and silver paste materials.
Thursday 14 March 2024
Server air cooling turning to 3D VC solutions for better efficiency, says DIGITIMES Research
With air cooling being the mainstream solution at data centers, 3D Vapor Chambers (VCs) have successfully broken through the theoretical heat dissipation limitations of air cooling...
Thursday 22 February 2024
Air cooling solutions for datacenter servers

Introduction

Wednesday 6 December 2023
Niching expects vapor chamber sales to climb over 50% in 2024
Niching Industrial, which sells IC packaging materials, anticipates vapor chamber sales will grow over 50% year on year in 2024. Increasing sales of vapor chambers is part of the...
Tuesday 29 August 2023
AVC upbeat about 3D vapor chamber demand
Cooling module maker Asia Vital Components (AVC), whose 3D vapor chambers (VC) are reportedly being certified by Nvidia, expressed optimism about 3D VC demand through 2024.
Wednesday 12 July 2023
Heat sink demand rising for advanced packaging, say distributors
IC materials distributors have enjoyed a ramp-up in orders for heat sinks, thanks to strong advanced packaging demand for HPC chips, according to industry sources.
Thursday 11 May 2023
Heat dissipation in high demand for AI servers
Heat dissipation for servers is in high demand due to the popularity of AI, according to Spencer Shen, chairman of cooling module maker Asia Vital Components (AVC).
Wednesday 22 March 2023
Vapor chamber adoption grows among notebooks
The use of vapor chambers (VC) in notebooks is increasing, boosting the sales performance of heat dissipation solution providers.
Wednesday 11 May 2022
NeoGene unveils novel ultra-thin heat-pipe-array vapor chamber technology for ultra-high-density power battery pack application
NeoGene Tech, a Guangzhou-based technology platform provider for mobile device thermal management, has unveiled a breakthrough solution for ultra-high-packaging-density power battery...
Monday 17 January 2022
Jieqiao reaches MagicWick-Inside Platform license agreement with NeoGene Tech, stepping into ultra-thin and big-size vapor chamber device production
Suzhou-based professional thermal module maker, Jieqiao Electronics Technology, announces it has reached a formal technology license agreement with NeoGene Tech to adopt MagicWick-Inside...
Tuesday 30 November 2021
Heat dissipation vendors cautiously optimistic about 2022 as Samsung reintroduces vapor chambers to new phones
Samsung Electronics reportedly is looking to once again use vapor chambers (VCs) in its new mobile phone models slated for launch in 2022. While it may not all be smooth sailing,...
Wednesday 8 September 2021
More smartphone vendors to adopt vapor chambers for new models
More China- and South Korea-based smartphone vendors are expected to adopt vapor chambers (VCs) for their new models slated for launch in the fourth quarter of 2021, according to...
Wednesday 1 September 2021
CCI expects 5G smartphones to drive vapor chamber demand
Overall vapor chamber (VC) demand for handsets has been a disappointment thus far this year, according to Junichi Nagai, chairman for cooling module firm Nidec Chaun-Choung Technology...
Friday 9 July 2021
Samsung reportedly reconsidering smartphones with vapor chambers
Samsung Electronics reportedly is reconsidering adopting vapor chambers for its new smartphones for 2022, which could benefit cooling solution providers' sales, according to sources...
Holtek
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research