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Monday 15 December 2025
SK Hynix taps ASMPT for HBM4 TC bonders amid Hanmi-Hanwha patent clash

SK Hynix has reportedly placed a new order for thermal compression (TC) bonders with Singapore-based ASMPT as it accelerates preparations...

Wednesday 16 July 2025
Hanmi Semiconductor says hybrid bonders too costly for HBM4, HBM5 production
Hanmi Semiconductor's chairman dismissed hybrid bonder equipment as impractical and too expensive for next-generation high-bandwidth memory production, as the South Korean company...
Friday 11 August 2023
Hanmi Semiconductor established new production site to prepare for TSV process orders in HBM
The AI trend has fueled the high-bandwidth memory (HBM) business opportunities, which in turn has brought attention to related equipment supplier Hanmi Semiconductor. Recently, to...