Wi-Fi connections in consumer electronics devices will rise from 113 million in 2008 to more than 285 million by 2012 with the growth of connected consumer electronics devices, according...
Lanner Electronics has announced the release of the VW-1104, a compact mobile DVR platform built on the Intel Atom CPU and offering Wi-Fi, 3G mobile and GPS communications along with...
Taiwan-based WiMAX licensee Global Mobile completed interoperability testing (IOT) with CPE (customer premise equipment) suppliers in August and will start selecting suppliers in...
Samsung Electronics on August 14 debuted three new digital camera models, ST500, ST550 and ST1000, for launch simultaneously in Taiwan, South Korea, the US, the UK and other main...
The combination of the global recession and excess inventory has set back the wireless semiconductor market to levels not seen since 2003, according to iSuppli.
In 2011 some 20 million TVs offering wireless connectivity will be shipped worldwide, according to ABI Research. As part of the continuing trend towards networked home entertainment,...
Chartered Semiconductor Manufacturing has recently ramped up production of its 65nm low-power (LP) process, dubbed 65nm LPe, targeting battery-operated and cost-sensitive mobile applications...
King Yuan Electronics Company (KYEC) and Sigurd Microelectronics, two Taiwan providers of IC assembly and test services, have seen their monthly performance continue improving with...
Intel has introduced four new processors, including a low-power version, and a value chipset, to usher in mainstream ultra-thin notebooks. Intel CULV processors will enable new consumer...
China is ready to release orders for WiMAX equipment and CPE products as its State Administration of Radio, Film and Television (SARFT) is set to kick off construction of WiMAX networks...
Socle Technology has announced its partnership with Catena and CoreSonic to develop a comprehensive design platform on Chartered Semiconductor's 65nm process with integrable wireless...
Tight supply of leadframes used in quad-flat-pack-no lead (QFN) packaging for network and communication chips is expected to ease at the end of May 2009, as Japan-based material suppliers...