Taiwan-based IC substrate maker Kinsus Interconnect Technology plans to restore a fire-hit flexible PCB (FPCB) plant in Hsinchu, northern Taiwan, and convert it to produce ABF substrates...
TSMC has seen capacity utilization rates for 28nm process technology surge and come to nearly 100% in the fourth quarter of 2020, thanks to the bulk of orders transferred by Qualcomm...
AMD and Xilinx have announced they have entered into a definitive agreement for the former to acquire the latter in an all-stock transaction valued at US$35 billion.
Intel has agreed to sell its NAND flash and storage business to SK Hynix, but the chipmaker is also facing increasingly intense competition from AMD, Nvidia and even Apple in its...
TSMC is on track to enter 3nm chip production with monthly output set to reach 55,000 wafers in the second half of 2022, according to sources familiar with the matter. The 3nm process...
TSMC has been stepping up the development of its advanced packaging business, with plans to open in 2021-2022 two new fabs dedicated to advanced packaging incorporating its newly...
Taiwan-based IC substrate makers including Unimicron Technology and Na Ya PCB are gearing up to strengthen business ties with US clients seeking to offset expected losses of orders...
Taiwan Semiconductor Manufacturing Company (TSMC) expects significant sales from the the high performance computing (HPC) sector in 2020, an indication that chip vendors are still...
TSMC has seen utilization of its chip-on-wafer-on-substrate (CoWoS) packaging capacity rise substantially in the second quarter of 2020, and now runs the packaging production lines...
Robust demand for ABF substrates has significantly driven up first-quarter 2020 revenues at Nan Ya PCB and Kinsus Interconnect, with the growth momentum expected to last through at...
Taiwan-based Answer Technology (ANStek), which distributes mainly ICs for niche-market applications, has reported net profits grew 2.5% to NT$182 million (US$6.02 million) in 2019...
Xilinx has announced Versal Premium, the third series in the Versal adaptive compute acceleration platform (ACAP) portfolio. The Versal Premium series features highly integrated,...
Taiwan's IC distributors have posted mixed revenues for February, with those distributing 5G base station, server and memory chips as well as niche applications performing better...
US FPGA chips specialist Xilinx will step up development of self-adaptive AI chips for automotive applications based on the emerging concepts of Mobility as a Service (MaaS) and Transportation...
High-end FPGA chips demand is mounting significantly for datacenter, 5G and AIoT applications, providing growth momentum for related wafer foundry, analysis and test players as well...
