Samsung Electronics reportedly will incorporate the latest EUV mask pellicles with a light transmittance rate of over 90% into its 3nm process for yield improvement, with the pellicles...
The most important significance of Samsung Electronics recently commercializing its 3nm GAA (gate-all-around) process technology lies in leading the paradigm shift of next-generation...
Foundry market competitions among TSMC, Samsung Electronics and Intel will heat up significantly as they are advancing to 3/2nm manufacturing nodes, and it seems that Samsung will...
LED driver IC design house Macroblock expects to post a double-digit sequential revenue increase with high gross margin in the second quarter of 2022, driven by robust demand for...
SK Hynix has reported operating profits jumped 116% from a year earlier to KRW2.86 trillion (US$2.26 billion) in the first quarter of 2022 when revenue climbed 43% on year to KRW12.16...
Samsung Electronics has been actively pursuing 3nm GAA chip orders, with speculation that AMD and Qualcomm could be among the first customers of its newer foundry process technology...
In the notebook processor supply chain, ABF substrates will be among certain components that will see shortage widen in 2022, which may tighten supply of notebook processors affecting...
Due to spec upgrades of new processors and growing difficulty in producing high-end ABF substrates with satisfactory yield rates, the world's actual ABF substrate supply growth could...
Semiconductor Manufacturing Electronics (ShaoXing), a China-based MEMS foundry startup formed by Semiconductor Manufacturing International (SMIC) and the local government, has managed...
Nvidia and Qualcomm reportedly have already reached agreements with TSMC for capacity support from its next-generation manufacturing processes, and with orders from Intel, Apple and...
The supply of more lucrative high-end ABF substrates for use in HPC, server and 5G networking chips has been increasingly short of demand due partly to insufficient yield rates at...
Major automotive chip vendors including NXP are mulling adopting FOPLP (fan-out panel level packaging) technology to process part of their peripheral automotive chips seeking to reduce...
Foldable-screen notebooks are estimated to be priced more than NT$70,000 (US$2,469) due to the high components costs, according to sources from the upstream supply chain.
AMD has been promised more 7nm foundry capacity at TSMC, but actual shipments for its PS5 chips will depend on the production yield rates for ABF substrates needed to make the customized...
