Nvidia has reportedly abandoned its initial SOCAMM1 low-power DRAM module for AI workloads, shifting focus to SOCAMM2 with faster speeds and broader supplier collaboration, including...

Pegatron chairman TH Tung attended the Taoyuan Enterprise Summit on September 12, during which he shared his views on the economic climate for the second half of 2025. Despite initial...

Foxconn chairman Young Liu reportedly has recently visited the US and met with executives including Alphabet and Google CEO Sundar Pichai, according to industry sources. Meanwhile,...

Ukrainian drones have earned a strong reputation on the battlefield after more than three years of conflict, becoming both frontline mainstays and global benchmarks for military te...

Ever since Academia Sinica announced a 5-qubit superconducting quantum computer in January 2024, and National Tsing Hua University unveiled a photonic quantum computer capable of...

At SEMICON Taiwan, Dr. Chris A. Mack, chief technology officer of Fractilia, said that stochastic variation—randomness in how features are printed on silicon—has become...

At the packed China International Optoelectronic Exposition (CIOE) held at the Shenzhen World Exhibition & Convention Center, Taiwan's OtO Photonics stood out for its specialized...

Generative AI tools have provided much amusement for consumers, yet the same enthusiasm has not translated to the enterprise market. This stems from significant limitations in the...

Potential uses for drones are ever-increasing, with Ukrainian President Volodymyr Zelensky once stating that 34% of Russia's bombers were destroyed using just 117 drones. This offers...

XPeng Aeroht, the flying car subsidiary of XPeng Motors, is accelerating its global expansion with plans for a debut overseas eVTOL test flight in Dubai in October 2025. Pending successful...

Taiwan's AI-driven semiconductor and server supply chains are growing rapidly, but experts say the wider economy and public benefit little. There are increasing calls for the government...

SK Hynix, a key supplier of HBM to Nvidia and other global clients, is reportedly scaling back its aggressive investment plans in thermo-compression bonders (TCB), equipment crucial...

To accelerate the development of heterogeneous integration and advanced packaging technologies, the "3DIC Advanced Manufacturing Alliance" was officially established on September...

TSMC continues to advance its investment plan for the Pingtung Science Park, officially opening the site for vendors to begin construction. Arthur Chuang, vice president of Facility...