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Thursday 30 December 2021
LG develops biometric recognition technology for keyless car ignition
LG Electronics has developed a new biometric recognition technology that enables car owners to ignite their vehicles without using a key by identifying their facial expressions and...
Thursday 30 December 2021
Building trust in the edge devices: Interview with the CEO of CollaboGate
IoT devices, on one side, offer extended features and functionality; on the other side, they are well-known with weaknesses and vulnerabilities. With its solution, Tokyo-based CollaboGate...
Thursday 30 December 2021
More Taiwan suppliers join TSMC in IC industry cluster in Arizona
More Taiwan-based suppliers are looking to join TSMC in the IC industry cluster in Arizona, the US, where the foundry is constructing an advanced wafer fab, according to industry...
Wednesday 29 December 2021
Taiwan GaN makers to embrace robust consumer applications in 2022
Taiwan GaN suppliers are in pole position to benefit from the mounting penetration of the new-generation compound semiconductor in consumer electronics applications in 2022, given...
Wednesday 29 December 2021
Taiwan fab toolmakers poised to enjoy at least 20% revenue growth in 2022
Fab toolmakers including All Ring Tech, Grand Process Technology (GPTC), Marketech International, Scientech, Trusval Technology and United Integrated Services (UIS), with many being...
Wednesday 29 December 2021
Unimicron showcases FOPLP substrates at SEMICON Taiwan 2021
IC substrate supplier Unimicron Technology is showcasing its newly-developed fan-out panel-level packaging (FOPLP) substrates at the ongoing SEMICON Taiwan 2021, looking to better...
Wednesday 29 December 2021
Nissan to equip all vehicles with LiDAR in 2030
Nissan plans to outfit all its production vehicles with LiDar in 2030, according to reports from Nikkan and Nikkei.
Wednesday 29 December 2021
Taiwan testing and analysis companies stand out in 3D chiplet, third-gen semiconductors
Taiwan's semiconductor supply chain will bring the biggest benefits to homogeneous/heterogeneous packaging, system-level testing (SLT), as well as advanced technology for materials...
Tuesday 28 December 2021
Hyundai to launch six more EVs in India by 2028
South Korean carmaker Hyundai is investing INR400 billion (US$530 million) in EV R&D in India and planning to launch six new electric cars by 2028, ranging from entry-level models...
Tuesday 28 December 2021
Taiwan aims to develop one-stop MaaS app
Taiwan is promoting the development of Mobility as a Service (MaaS). Earlier in 2021, the Ministry of Transportation and Communication (MOTC) authorized a MaaS plan for four counties...
Tuesday 28 December 2021
Legacy Europe and US automakers to face tremendous challenges in electric vehicles
Ten years ago, Apple revolutionized the global mobile phone sector with its iphones. The same scenario could be seen in the electric vehicle (EV) industry now. Legacy Europe and US-based...
Tuesday 28 December 2021
Server ODMs to raise production capacities worldwide
Quanta Computer, Wiwynn and Inventec are set to expand their capacities worldwide with Quanta set to increase the output from the SMT plant in Thailand and the assembly factories...
Tuesday 28 December 2021
Chipmakers explore more methods other than chip scaling, says ex-TSMC R&D VP
There are more ways than one to improve on chip performance and power, and with chip scaling generating more costs, chipmakers are exploring more methods in their technology advancements,...
Tuesday 28 December 2021
Heterogeneous integration, compound semi in spotlight at SEMICON Taiwan 2021
SEMICON Taiwan 2021 has kicked off in Taipei running from December 28-30, with this year's theme focusing on heterogeneous integration, compound semiconductors and other chipmaking...
Monday 27 December 2021
Nissan to build EV battery recycling facilities in Europe and US in five years
Nissan will set up electric vehicle (EV) battery recycling plants in Europe and the US through its subsidiary before the fiscal year 2025, apart from continuing promoting battery...