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Thursday 10 September 2026
DeepSeek's next AI test is not the model; it's everything around it

DeepSeek has opened roughly 150 positions in a new hiring round focused almost entirely on engineering and infrastructure, pointing to...

Thursday 10 September 2026
DB HiTek completes reliability qualification for 8-inch SiC MOSFET process
DB HiTek said it has completed reliability qualification for its 1,200 V silicon carbide (SiC) MOSFET process on 8-inch wafers. The development could expand foundry capacity for next-generation...
Thursday 10 September 2026
Compute-in-memory returns to the spotlight with edge AI's power, memory squeeze
AI is shifting from data centers to PCs, personal AI systems, robots, and other edge devices, renewing a core semiconductor challenge: delivering enough compute and memory bandwidth...
Thursday 10 September 2026
JD Cloud plans 100,000-GPU cluster built on Moore Threads chips
JD Cloud said on September 9 that it plans to build a 100,000-card cluster of full-function GPUs supplied by Moore Threads, a deployment the company describes as the first time domestic...
Thursday 10 September 2026
China gets an early shot at the next SiC power-chip cycle

Alkaidsemi (Shanghai) Technologies Corporation has introduced a 1,200 V silicon carbide superjunction MOSFET that it describes as the...

Thursday 10 September 2026
Beyond the stage, can XPeng's EV playbook scale humanoid robots?
As humanoid robotics glides — in its own distinctive glamour — toward becoming one of the most visible manifestations of physical AI, the once-unimaginable idea of where...
Thursday 10 September 2026
CXMT's HBM3 yield reportedly stalls at 25% as TSV and stacking challenges expose China's AI memory gap

China's leading DRAM maker ChangXin Memory Technologies (CXMT) has begun trial production of HBM3, but its initial yield has reportedly...

Thursday 10 September 2026
Apple's iPhone Duo raises the stakes for foldable smartphone cameras

Apple's foldable iPhone Duo could reshape the global smartphone market, pushing Android brands to move faster on foldable handsets and...

Thursday 10 September 2026
China's 6G race starts before the first 6G phone as satellite links move into the network core

China's next-generation communications push is beginning to reveal a broader ambition than simply putting faster wireless connections...

Thursday 10 September 2026
Loongson raises funds to expand CPU and GPU development as AI inference boosts domestic chip plans
Chinese CPU maker Loongson recently announced a CNY2.3 billion (approx. US$342.7 million) capital increase, with the funds mainly going into information technology chips and core CPU...
Thursday 10 September 2026
Apple's 100-part iPhone Duo hinge puts spotlight on Chinese suppliers
Apple's first foldable iPhone is putting Chinese precision-component makers under closer scrutiny as its complex hinge creates new opportunities in structural parts, metal injection...
Thursday 10 September 2026
Panasonic Energy unveils high-temperature solid-state battery, targets industrial uses, robotics

Panasonic Energy has developed a new solid-state battery capable of operating at temperatures up to 150 degrees Celsius (302 degrees...

Thursday 10 September 2026
Samsung India reportedly cuts jobs as memory costs squeeze electronics unit
Samsung Electronics' Indian unit has reportedly started cutting jobs in its TV and home-appliance businesses as higher memory-chip prices, currency weakness, and soft consumer demand...
Thursday 10 September 2026
Analysis: China chases EUV as chipmakers move to High-NA
The extreme ultraviolet (EUV) lithography race is splitting into two tracks. Intel has moved High-NA EUV into production, Samsung Electronics and SK Hynix are targeting DRAM production...
Thursday 10 September 2026
Yageo's August revenue hits record on AI demand
Yageo posted year-over-year and month-over-month revenue growth in August, extending its streak of record monthly highs to a sixth straight month. The passive components maker said...