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Friday 3 November 2017
Gowin, TSMC team up for 28nm FPGA chips
China-based Gowin Semiconductor has announced the development of its first 28nm FPGA product, the GW3AT-100, fabricated by Taiwan Semiconductor Manufacturing Company (TSMC).
Thursday 2 November 2017
IoT in China: Q&A with Advantech executive
Industrial computing device maker Advantech has been promoting IoT (Internet of Things) applications to the manufacturing sector and smart cities in China, according to Industrial...
Thursday 2 November 2017
SK Hynix to expand DRAM production capacity in China
SK Hynix recently struck a deal with China's city government of Wuxi to expand its DRAM production capacity locally with total investment estimated at US$8.6 billion, according to...
Thursday 2 November 2017
DRAMeXchange predicts higher DRAM bit growth in 2018
With Samsung looking to expand production capacity, the global bit growth of DRAM in 2018 is projected to reach 22.5% compared with 19.5% in 2017, according to DRAMeXchange.
Wednesday 1 November 2017
Micron intros industrial microSD cards for surveillance
Micron Technology has announced a full portfolio of edge storage solutions for video surveillance that will enable new deployment models and reduce total cost of ownership for both...
Wednesday 1 November 2017
China top-4 vendors to ship over 400 million handsets in 2017
China's top-four handset vendors Huawei, Xiaomi Technology, Oppo and Vivo together will ship a total of over 400 million mobile phones globally in 2017, and their combined shipments...
Wednesday 1 November 2017
Global semiconductor industry posts highest-ever quarterly sales, says SIA
Worldwide sales of semiconductors reached US$107.9 billion in the third quarter of 2017, marking the industry's highest-ever quarterly sales and an increase of 10.2% compared to the...
Tuesday 31 October 2017
China firms to invest CNY18 billion to develop 19nm DRAM technology
China-based GigaDevice Semiconductor and Hefei RuiLi Integrated Circuit Manufacture (formerly Hefei ChangXin IC) will team up to develop 19nm DRAM process technology for the production...
Monday 30 October 2017
Dynamic, smart production in China: Q&A with iSESOL GM Zhu Zhihao
While the sharing economy is gaining momentum nowadays, the manufacturing sector is also utilizing cloud service platforms to materialize new business models associated with Industry...
Monday 30 October 2017
China looks to start 5G commercial operations in 2018
Pushed by government policies and accelerated deployments of 5G networks by telecom operators, some first-tier cities in China may leapfrog those in other countries including Japan,...
Monday 30 October 2017
ASE likely to post record 4Q17 revenues
Advanced Semiconductor Engineering (ASE) expects sales of its core IC assembly test and material (ATM) business to register flat sequential growth in the fourth quarter, while sales...
Friday 27 October 2017
Maanshan Electronics Expo focusing on AI and IoT business opportunities
Maanshan Electronics Expo hosted in Maanshan, China from October 27-30 is focusing on latest technology trends including artificial intelligence (AI) and Internet of Things (IoT),...
Friday 27 October 2017
China firms to expand global presence in entry-level FPGA market
China-based FPGA chip suppliers including Shanghai Anlogic Information Technology, Shenzhen Pango Microsystems, Gowin Semiconductor, Xian Intelligence Silicon Tech and AGM Microelectronics...
Friday 27 October 2017
BOE starts volume production at China first 6G AMOLED fab
China-based BOE Technology Group kicked off its 6G AMOLED panel production line in Chengdu, Sichuan for volume production on October 26, marking the official run of the country's...
Friday 27 October 2017
Supply of high-density NOR flash to remain tight in 2018, says Macronix chairman
The supply of high-density NOR flash memory will remain tight through 2018, while the low-density market segment will be affected by China-based suppliers' new capacities, according...