Austria-based ams and China-based Ningbo Sunny Opotech, an optical image system solution provider, have announced a collaboration to jointly develop and market 3D sensing camera solutions...

Android smartphone vendors including Huawei, Oppo and Xiaomi Technology are expected to equip 3D sensing functionality to their new models slated for launch in 2018, according to...

IPC provider Ennoconn plans to set up an operational and development center in Suzhou, eastern China in 2018 in order to grasp business opportunities arising from the China government's...

Semiconductor Manufacturing International Corp (SMIC), China's largest foundry, will kick off volume production of 14nm FinFET process technology in 2019 and launch its second-generation...

MediaTek is aggressively persuading China smartphone vendors to adopt its Helio P processors to reduce risks of heavy reliance on Qualcomm, whose operations might be affected by Broadcom's...

Smartphone shipments in the China market reached 112.8 million units in the third quarter of 2017, increasing 18.6% sequentially but decreasing 1.9% on year. China shipments accounted...

Nanjing is gaining momentum to become a "chip city" in China, as many semiconductor firms have newly announced plans to set up operations in its Jiangbei New Area, including China's...

Yangtze River Storage Technology (YMTC) under the Tsinghua Unigroup has successfully developed 32-layer 3D NAND flash chips, marking a new milestone and major technological breakthrough...

HTC has unveiled the Vive Focus, its all-in-one VR headset, at the Vive Developer Conference held in Beijing recently. The model features an AMOLED display, Qualcomm's Snapdragon...

Power discrete component supplier HY Electronic specializing in diode products has disclosed plans to acquire a 70% stake in Taiwan GPP (TGI) for NT$350 million (US$11.52 million).

Sales in the global DRAM market surged 16.2% sequentially to a record US$19.18 billion in the third quarter of 2017, when contract prices of various DRAM products rose by about 5%...

Qualcomm has announced that it has signed three non-binding memoranda of understanding (MoU) wherein Xiaomi Technology, Oppo Mobile Telecommunications and Vivo Communication Technology...

Qualcomm has announced that its subsidiary, Qualcomm Technologies, and Alibaba have ported Alibaba Cloud Link One to run on the Qualcomm MDM9206 global multi-mode LTE IoT modem. This...

Taiwan fabless IC firms are aggresively vying to secure capacity at 8-inch foundries to meet increasing orders in 2018, particularly for MCU and MOSFET chips needed to support a variety...

China AI unicorn SenseTime is reportedly to announce a new round of financing estimated at around US$500 million within one month, which will be the largest scale of its kind seen...