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Friday 24 April 2020
Taiflex building new plant in China to produce high-frequency FCCL
Flexible copper-clad laminate (FCCL) supplier Taiflex Scientific is building a new plant in Nantong, China's Jiangsu province, to produce high-frequency, high-speed FCCL materials...
Friday 24 April 2020
China ODMs gearing up for 5G smartphone market boom
China-based ODMs including Wingtech Technology and Huaqin Telecom Technology are striving to grow their presence in the 5G smartphone market.
Thursday 23 April 2020
Eternal sees robust orders for dry-firm photoresist
Taiwan-based Eternal Materials currently sees full utilization of its dry-film photoresist production capacity, while that of its paper phenolic copper clad laminate is at between...
Thursday 23 April 2020
Unisoc makes gains in mid-tier 5G SoC market
China-based SoC solution provider Unisoc has made significant gains in China's mid-tier 5G SoC chip market after local IT product vendor Hisense launched its 5G phone, the F50 5G,...
Wednesday 22 April 2020
HDI PCB makers enjoy robust demand for server memory modules
Taiwan-based HDI PCB firms including Unimicron Technology, Tripod Technology and Dynamic Electronics continue to see a ramp-up in demand for server and datacenter memory modules,...
Wednesday 22 April 2020
LCP antenna shipments to stay weak for mmWave 5G phones in 2020
As mmWave 5G phone market will see limited development momentum in 2020, shipments of flexible LCP (liquid crystal polymer) antenna boards for mmWave 5G smartphones are expected to...
Wednesday 22 April 2020
Taiwan cooling module firms see keener competition in handset space
Taiwan-based cooling module specialists including Auras Technology expect ASPs for handset-use solutions to drop about 10% in the second half of 2020, due to competition from Chinese...
Tuesday 21 April 2020
Highlights of the day: Chinese vendors focus on affordable 5G smartphones
The handset market has been hit hard by the coronavirus pandemic, but China is banking on 5G smartphones to help reboot its economy. Chinese vendors are expected to roll out more...
Tuesday 21 April 2020
Huawei/HiSilicon to commercialize new NB-IoT chip solution in 4Q20
Huawei/HiSilicon will commercialize a new NB-IoT chipset, dubbed Boudica 200, by the end of 2020, which will support 3GPP R15 standards and offer lower latencies and more integrated...
Tuesday 21 April 2020
Taiwan PCB makers eyeing 5G infrastructure, HPC applications for 2020 growth
Taiwan-based PCB makers are expected to see robust demand for 5G base stations, servers, networking equipment and HPC devices significantly drive up their shipments in 2020 while...
Tuesday 21 April 2020
Affordable sub-6 GHz 5G phones to hit market in 2H20
China-based handset makers have been keen on developing 5G phones supporting sub-6GHz technology, with prospects to see some brands roll out 5G models priced below CNY3,000 (US$424)...
Tuesday 21 April 2020
Taiwan IC firms see orders for 5G infrastructure pull in from China
Taiwan-based IC design houses have landed a pull-in of orders for 5G base-station and customer-premise equipment (CPE) from China, according to sources at Taiwan's IC distributors.
Monday 20 April 2020
ASE Technology enters Huawei server CPU ecosystem
ASE Technology has entered the backend supply chain of Huawei/HiSilicon's ARM-based Kunpeng 920 server CPU, with its affiliated Siliconware Precision Industries (SPIL) set to start...
Monday 20 April 2020
TSMC ecosystem players to see positive 2020 despite pandemic
Members in the TSMC Grand Alliance have been fully assured that their revenue and profit growth momentum will not slow down in the months ahead, bolstered by the foundry's better-than-expected...
Friday 17 April 2020
Competition in 5G chip market to heat up as phone shipment outlook turns weak
Competition in the 5G SoC solution and related chip segments is set to become fiercer in the second half of 2020 as demand for 5G phones has been deferred and the forecasts of global...