Kemet announced recently the Committee on Foreign Investment in the United States (CFIUS) has completed review of the pending acquisition of Kemet by Taiwan-based Yageo and determined...
High-frequency and high-speed flexible PCBs are emerging as indispensable components for antenna transmission modules for hand-held devices, IoT networking equipment and automotive...
Shipments of voice coil motors (VCMs) used in camera modules for Apple's upcoming 5G iPhones are likely to see a slowdown around the middle or the latter half of the second quarter,...
Chunghwa Precision Test Tech (CHPT) has seen strong demand in the short term for its vertical probe cards (VPCs) for processing handset APs, RF, HPC and ASIC solutions increasingly...
5G AP price competition between Qualcomm and MediaTek is expected to heat up further in the second quarter of 2020 as both chipmakers are gearing up to win more orders from Chinese...
Flexible copper-clad laminate (FCCL) supplier Taiflex Scientific is building a new plant in Nantong, China's Jiangsu province, to produce high-frequency, high-speed FCCL materials...
Taiwan-based Eternal Materials currently sees full utilization of its dry-film photoresist production capacity, while that of its paper phenolic copper clad laminate is at between...
China-based SoC solution provider Unisoc has made significant gains in China's mid-tier 5G SoC chip market after local IT product vendor Hisense launched its 5G phone, the F50 5G,...
Taiwan-based HDI PCB firms including Unimicron Technology, Tripod Technology and Dynamic Electronics continue to see a ramp-up in demand for server and datacenter memory modules,...
As mmWave 5G phone market will see limited development momentum in 2020, shipments of flexible LCP (liquid crystal polymer) antenna boards for mmWave 5G smartphones are expected to...
Taiwan-based cooling module specialists including Auras Technology expect ASPs for handset-use solutions to drop about 10% in the second half of 2020, due to competition from Chinese...
The handset market has been hit hard by the coronavirus pandemic, but China is banking on 5G smartphones to help reboot its economy. Chinese vendors are expected to roll out more...
Huawei/HiSilicon will commercialize a new NB-IoT chipset, dubbed Boudica 200, by the end of 2020, which will support 3GPP R15 standards and offer lower latencies and more integrated...
Taiwan-based PCB makers are expected to see robust demand for 5G base stations, servers, networking equipment and HPC devices significantly drive up their shipments in 2020 while...
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