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Thursday 26 September 2019
Qualcomm readies solutions to address 5G mmWave tech challenges
Construction of 5G mmWave base stations has been slow worldwide except in the US due to some major challenges affecting the development of related technologies, but Qualcomm has come...
Thursday 26 September 2019
5G phone shipments in China, Korea to total 10 million units in 2019
Combined shipments of 5G-enabled smartphones from Chinese and Korean vendors are expected to reach about 10 million units in 2019 - a result of collaboration between telecom operators...
Thursday 26 September 2019
TSMC advises clients to book 7nm capacity for entire 2020
TSMC has advised its clients to book foundry capacity well in advance for their 7nm chip demand for the entire 2020, according to industry sources.
Thursday 26 September 2019
CHT, Kingwaytek to build 5G test field for autonomous driving
Chunghwa Telecom (CHT) is teaming up with electronic map and navigation software provider Kingwaytek Technology to build a local government-backed 5G test field in northern Taiwan...
Wednesday 25 September 2019
Chipmakers eyeing entry-level to mid-tier 5G SoC market
The entry-level to mid-tier SoC solution segment has become the main battlefield for winning 5G SoC orders as major chip players including Qualcomm, MediaTek and Unisoc are gearing...
Wednesday 25 September 2019
PTI to invest US$200 million to expand high-end testing capacity
Backend house Powertech Technology (PTI) plans to invest up to US$200 million to expand production capacity for high-end logic chips at its Suzhou (China) plant, according to market...
Tuesday 24 September 2019
Anli to see efforts pay off in non-notebook cooling segments in 4Q19
Taiwan-based notebook thermal solutions provider Anli International expects its deployments in non-notebook segments to bear fruit starting in the fourth quarter of 2019, when the...
Monday 23 September 2019
TSMC may join forces with OSAT firms to build SoIC ecosystem
In the era of heterogeneous chips integration, Taiwan Semiconductor Manufacturing Company (TSMC) is expected be among global top-3 players in the advanced 3D IC packaging field along...
Monday 23 September 2019
CHPT gains VPC orders from Israel, China
Chunghwa Precision Test Tech (CHPT) has gained new growth momentum as it has received new VPC (vertical probe card) orders from Israeli and Chinese clients for processing ASICs, AI...
Friday 20 September 2019
MediaTek on track to kick off 5G SoC volume production in 1Q20
MediaTek is on track to enter volume production of its first 5G SoC for sub-6GHz networks in January 2020, having begun sampling the chips in the third quarter of 2019, according...
Friday 20 September 2019
ASE building lights-out fabs to enhance high-end packaging
Backend service leader ASE Technology Holding plans to set up 15 lights-out fabs by the end of 2020 as part of its efforts to strengthen smart production capability to support high-end...
Friday 20 September 2019
CHPT develops OTA test solutions for mmWave devices
Wafer test solution provider Chunghwa Precision Test Tech (CHPT) has announced the development of over-the-air (OTA) test solutions for mmWave 5G devices, including mmWave antenna-in-package...
Thursday 19 September 2019
TPCA Show 2019 - the PCB industry embraces explosive opportunities arising from 5G commercialization
TPCA Show 2019 will take place October 23 to October 25, 2019 at the Taipei Nangang Exhibition Center Hall 1 (TaiNEX 1). Themed on "5G Next," this year's exhibition will focus on...
Wednesday 18 September 2019
Memory market expected to rebound in 2020
The emerging AI, IoT and 5G applications will be stimulating related chip and component demand, with a rebound likely to take place in the memory market next year, according to market...
Wednesday 18 September 2019
PCB shipment prospect for new iPhones uncertain till early October
PCB manufacturers in the supply chain for Apple's iPhone 11 series are keeping a close eye on the new models' initial sales performance, which will determine their shipment momentum...