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Thursday 19 September 2019
TPCA Show 2019 - the PCB industry embraces explosive opportunities arising from 5G commercialization
TPCA Show 2019 will take place October 23 to October 25, 2019 at the Taipei Nangang Exhibition Center Hall 1 (TaiNEX 1). Themed on "5G Next," this year's exhibition will focus on...
Wednesday 18 September 2019
Memory market expected to rebound in 2020
The emerging AI, IoT and 5G applications will be stimulating related chip and component demand, with a rebound likely to take place in the memory market next year, according to market...
Wednesday 18 September 2019
PCB shipment prospect for new iPhones uncertain till early October
PCB manufacturers in the supply chain for Apple's iPhone 11 series are keeping a close eye on the new models' initial sales performance, which will determine their shipment momentum...
Wednesday 18 September 2019
Huawei stepping up IC substrate purchases from Taiwan
Huawei is stepping up purchases of IC substrates from its Taiwan-based suppliers, including Unimicron Technology and Nan Ya PCB, according to industry sources.
Wednesday 18 September 2019
Advantest showcasing new test solutions for 5G, automotive and memory
Semiconductor test equipment supplier Advantest is presenting its latest solutions for 5G, next-generation memory, automotive and power device applications during the Semicon Taiwan...
Tuesday 17 September 2019
Unitech enjoys brisk rigid-flex PCB shipments for TWS earphones
PCB manufacturer Unitech Printed Circuit Board has seen revenue contribution for rigid-flex board shipments rise from 30% in 2018 to 50% currently, thanks to strong orders for TWS...
Tuesday 17 September 2019
5G is vital for Taiwan digital transformation
Successful development of technology concerning 5G, which pomises considerable growth potential, will be key to catapulting Taiwan into a digital economy and smart island, according...
Tuesday 17 September 2019
ASE gearing up for 5G mmWave AiP, RF modules assembling
Leading IC backend house ASE Technology Holding will have its fan-out (FO) packaging technology ready in 2020 at the earliest for volume production of mmWave antenna-in-package (AiP)...
Tuesday 17 September 2019
Win Semi to expand GaAs wafer production capacity in 2Q20
GaAs foundry Win Semiconductors plans to expand production capacity by around 5,000 6-inch wafers monthly in the second quarter of 2020 to meet ever-increasing compound semiconductor...
Tuesday 17 September 2019
5G phones to come with multiple SoC platforms
Apart from Samsung and Huawei, both of which rely heavily on chips developed in-house, other first-tier China-based smartphone vendors including Oppo, Vivo, Xiaomi and OnePlus are...
Tuesday 17 September 2019
TSMC 7nm production lead time extended
The lead time for production of 7nm chips at Taiwan Semiconductor Manufacturing Company (TSMC) has extended to nearly six months from the previous two months because of strong demand,...
Monday 16 September 2019
Heat-sink solution providers to brace for strong sales along with 5G deployments
The development of 5G networks including infrastructures, edging computers and end-market devices will significantly scale up global demand for heat-sink solutions in 2020 and beyond,...
Monday 16 September 2019
WinWay to thrive on robust demand for high-end IC sockets
As 7nm and more-advanced process nodes are increasingly applied to fabricating high-performance computing (HPC) CPUs and GPUs, demand for high-end IC sockets for SLT (system level...
Monday 16 September 2019
PCB makers see stronger momentum from 5G smartphones than base stations
For PCB makers, especially those based in Taiwan, 5G business opportunities from smartphones may outrace those from base stations as demand for the latter has been dented by slowed...
Thursday 12 September 2019
MediaTek to open new building for 5G R&D
MediaTek is set to unveil a new office building in northern Taiwan in mid September, which will be dedicated to the development of 5G chip technologies while also serving as the chipmaker's...