US-based semiconductor assembly equipment supplier Kulicke & Soffa (K&S) is optimistic that 5G and AI applications will drive demand for advanced IC packaging equipment.
Global demand for 5G chips supporting the sub-6 GHz standards is likely to gain momentum as telecom operators in China, which has the potential to become the world's largest market...
In addition to benefiting system operators, handset vendors and other players, the commercialization of 5G networks will help drive a fast development of VR applications, which could...
Device pricing is expected to be a major factor determining the pace of growth in China's 5G smartphone market next year, and Chinese vendors are keen to make sure that their phones...
Backend house ASE Technology Holding has offered a development board based on its system-in-package (SiP) services for heterogeneous SoC chips designed for true wireless stereo (TWS)...
Handset component suppliers, particularly those for camera modules, displays and acoustic devices, are facing increasing pressure from China's handset vendors to lower their quotes...
MediaTek is scheduled to roll out the company's first 5G SoC for sub-6GHz networks in early 2020, with plans to launch its second 5G mobile chip that will also support sub-6GHz in...
Incorporating AI capabilities into terminal edge devices has become an inevitable trend, as intelligent devices are needed to facilitate effective machine-to-machine communication...
TSMC and other major Taiwanese IC backend service providers including ASE Technology and Powertech Technology (PTI) are ready to offer, or have exerted efforts to develop, AiP (antenna-in-package)...
Silicon carbide (SiC) substrate quotes are likely to fall by over 20% in 2020 due to constant capacity expansions at major suppliers and impacts of the US-China tariff war, according...
MediaTek reportedly has increased its wafer start orders for 5G chips at TSMC as more of its handset clients in China have taped out 5G-focused smartphones using its SoC solutions,...
TSMC has announced it filed multiple lawsuits on September 30, 2019 against Globalfoundries in the US, Germany and Singapore for its alleged ongoing infringement of 25 TSMC patents...
The market for passive components is likely to bottom out in the fourth quarter of 2019 and gradually rebound on 5G commercialization in 2020, according to industry sources.
Taiwan's IC designers are set to ramp up shipments of diverse optical in-display fingerprint sensors for smartphone application starting in the first quarter of 2020, and backend...
