Chinese panel manufacturer BOE has recently announced the construction of its 8.6G IT OLED production line, known as B16. This development has significantly benefited numerous South...
AI startup Tenstorrent, led by chip industry veteran Jim Keller as CEO, recently announced a new generation of AI hardware featuring the Wormhole Tensix processor equipped with RISC-V...
Observers believe that US President Joe Biden's decision to forgo his re-election bid will undoubtedly boost Donald Trump's chances of returning to the White House. This could likely...
Promoting the development of the artificial intelligence (AI) industry is one of Taiwan's key priorities, according to Yennun Huang, Minister of Digital Affairs. Relevant measures...
South Korea's imports of panel manufacturing equipment soared tenfold in the first half of 2024 compared to the same period in 2023, reaching approximately US$315 million. This dramatic...
With Taiwan Semiconductor Manufacturing Company (TSMC) chairman C. C. Wei promising to carry through overseas expansion plans regardless of the next US President, those securing TSMC's...
On July 21, US President Joe Biden announced that he would not seek re-election, a decision that adds new variables to the semiconductor and electronic manufacturing supply chain...
Disappointing results from NXP Semiconductors in its latest financial report may indicate that car manufacturers are becoming more conservative and the development of battery electric...
NXP reported that its performance was affected by its customers' inventory management practices. Despite this, the company expressed strong confidence in its joint venture with Taiwan-based...
Texas Instruments (TI) provided financial guidance that is slightly lower than expectations. The company's capital expenditure (Capex) plan is progressing smoothly, indicating significant...
TSMC has witnessed an increase in orders from Chinese customers seeking super hot runs (SHR), for which they are willing to pay a 40% premium, according to industry sources.
Glass substrates have become a critical strategic element in fan-out panel level packaging (FOPLP), a technology that TSMC and various backend houses are developing. Because of that,...
When will AI PC dividends start to pay off for the chip industry? This question has been closely followed by many in the industry during the first half of 2024. The launch of Copilot+PC,...
Despite high costs and labor shortages, TSMC has adhered to its international plans to build wafer fabrication plants in Japan, the United States, and Germany.
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