NXP Semiconductors and Pegatron have announced plans to open a joint laboratory and work together on various automotive electronics applications. Their early partnership will concentrate...
The adoption of automotive Ethernet is increasing at a fast pace, which is likely to create significant economic prospects for related chip suppliers, according to industry sources...
Alchip Technologies, a Taiwan-based ASIC service and silicon IP provider with AWS as its main client, has announced that Amazon will subscribe to its shares via private placement.
Taiwan's National Science and Technology Council (NSTC) announced the launch of the "IC Taiwan Grand Challenge" on May 14 to attract global IC-related teams to Taiwan to propose research,...
Taiwan's panel makers saw mixed business performances in April, but major suppliers of large-sized panels, AU Optronics (AUO) and Innolux, are optimistic that their shipments will...
The South Korean government is planning a comprehensive semiconductor investment support program, with a scale exceeding KRW10 trillion (US$7.304 billion). The aim is to strengthen...
With the rise of AI, SK Hynix has successfully developed a new mobile NAND Flash solution called ZUFS (Zoned UFS) 4.0, targeting on-device AI applications.
Polar Semiconductor, the only US-based manufacturer specializing in sensor, power, and high-voltage semiconductors, disclosed plans to expand its Bloomington, Minnesota manufacturing...
Intel has announced the appointment of Kevin O'Buckley as senior VP and GM of Foundry Services, the customer service and ecosystem operations division of Intel Foundry. O'Buckley...
Taiwan-based IC design firms have been coping with aggressive price slashing from China-based competitors, in one of the most challenging situations the industry has faced for more...
Semiconductor materials distributors are optimistic about operations in the second quarter of 2024, driven by rising semiconductor capacity and long-term demand for AI and High-Performance...
Huawei has recently launched its Pura 70 series smartphones featuring its in-house developed Kirin 9010 application processors made using SMIC's 7nm N+2 manufacturing process.
The AI boom is driving chipmaking advancements, with Co-Packaged Optics (CPO) promising to stake a claim as a favored semiconductor packaging technology along with CoWoS.
Although Taiwanese IC design companies generally have a grasp on demand for the second quarter, when it comes to the demand situation for the second half of the year, most manufacturers...
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