CONNECT WITH US
Global supply chain: Key components
Key components news coverage
IN THE NEWS
Monday 24 July 2023
USI collaborates with automotive SoC solution providers for smart cockpit innovation
Leading semiconductor companies like NXP, Nvidia and MediaTek are working on using AI in future smart cockpits. Universal Scientific Industrial (USI), which is experienced in system-in-package...
Monday 24 July 2023
Semiconductor equipment giants expanding investments in Taiwan to better serve TSMC ecosystem
TSMC's latest development roadmaps show its advanced manufacturing process technology will remain rooted in Taiwan, with not only its 2nm chip plant already under construction in...
Monday 24 July 2023
With MediaTek's earnings call on the horizon, inventory clearance progress receives attention
MediaTek's earnings call is set to be held on July 28. Recent market news includes TSMC releasing a conservative outlook for the year's second half. Additionally, MediaTek's shareholders'...
Monday 24 July 2023
Rapidus estimates the price of its 2nm chips at 10x current mainstream products
Rapidus, the Japanese government-backed semiconductor consortium, announced that the price of its 2nm chips will be 10 times that of the current mainstream chip products produced...
Monday 24 July 2023
TPCA: Taiwan should strengthen high-end PCB supply chain to tap AI server opportunities
The printed circuit board (PCB) for AI servers is a high-end, high-value PCB for terminal applications, and the process technology threshold is higher, so fewer manufacturers have...
Monday 24 July 2023
Foxconn partners with ADI to develop new-generation digital cockpit
Foxconn has developed multiple partnerships as it scales up its semiconductor and EV businesses. The company recently announced a collaboration with US-based semiconductor company...
Monday 24 July 2023
Taiwan in pole position to develop next-generation biomedical chips
Biomedicines are often seen as the next pivotal industry beyond semiconductors to bolster Taiwan's economic development, and the close combination of both sectors to develop the next-generation...
Monday 24 July 2023
Cerebras, G42 unveil supercomputer for AI training
Cerebras Systems and G42, a United Arab Emirates-based technology holding company, have jointly announced Condor Galaxy, a network of nine interconnected supercomputers with a novel...
Monday 24 July 2023
Renesas develops complete power management solution for AMD space-grade adaptive SoC
Renesas Electronics has announced a complete space-ready reference design for AMD's Versal adaptive system-on-chips (SoC). Developed in collaboration with AMD, the ISLVERSALDEMO2Z...
Monday 24 July 2023
India roundup: Foxconn prepares production expansion in India as it becomes Apple's fifth-largest market
Following the US and Japan signed an MoU with India for semiconductor cooperation. India may take equity in IC design houses to nurture national champions as the country is eager...
Friday 21 July 2023
Lisa Su: AI makes the next 10 years much, much more exciting
AMD chair and CEO Lisa Su came to Taiwan this week for business meetings, as well as to receive an honorary doctorate degree from the National Yangming Chiaotung University in Hsinchu...
Friday 21 July 2023
Chinese IC designers keen to develop homegrown smart cockpit SoCs
Along with cars moving toward electrification and intelligence, the smart cockpit market is gradually gaining prominence. Currently, many Chinese carmakers adopt intelligent cockpit...
Friday 21 July 2023
Interview with Synopsys CEO Aart de Geus: AI tools will accelerate realization of SysMoore law
The emergence of ChatGPT in late 2022 and early 2023 has promoted a new wave of AI trends. The semiconductor sector has received some of the most attention amidst this trend. This...
Friday 21 July 2023
Cadence to acquire Rambus PHY IP assets
Cadence Design Systems and Rambus, a premier chip and silicon IP provider making data faster and safer, today announced that they have entered into a definitive agreement for Cadence...
Friday 21 July 2023
Panel tech to become mature for AR/VR and naked eye 3D applications by 2030, says DIGITIMES Research
Panel technologies such as micro OLED, OLED on silicon (OLEDoS), and micro LED are being actively developed for consumer applications, as well as glasses-free 3D technologies. These...