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IN THE NEWS
Wednesday 21 September 2022
Specialty DRAM demand unlikely to pick up until 2023
Specialty DRAM demand for mainly consumer electronics device applications is unlikely to pick up until 2023, and may see an L-shaped recovery, according to industry sources.
Tuesday 20 September 2022
Chinese IC startups face uncertain outlook
Macroeconomic factors and changing investment strategy have taken their bites on China's semiconductor startups. As Financial Times reported, weakening market demand, especially...
Tuesday 20 September 2022
Flexible PCB demand picking up
Flexible PCB suppliers have seen demand start picking up in September, with the growth momentum mainly from shipments for recently-released new iPhones, according to market sources...
Tuesday 20 September 2022
GlobalFoundries becomes latest constituent to PHLX Semiconductor Sector Index
US semiconductor foundry service company GlobalFoundries (GF) has announced that it has been added to the PHLX Semiconductor Sector Index (SOX), effective Monday, September 19, 202...
Tuesday 20 September 2022
Vertical integration is trending, but things won't be so easy for car OEMs
At Semicon Taiwan 2022, executives from Denso, Renesas, and Infineon shed light on the major changes taking place in the automotive supply chain. Denso is one of the largest automotive...
Tuesday 20 September 2022
Semiconductor probe card suppliers may see earnings erode in 2023
Companies specializing in probe cards for wafer tests and load boards for final tests may see their profits erode in 2023 as chipmakers including foundry TSMC and fabless firm MediaTek...
Tuesday 20 September 2022
Smartphones supporting Wi-Fi 7 may arrive as early as 2H24
The first smartphones supporting much faster Wi-Fi 7 connections may debut as early as the second half of 2024, according to sources at IC backend houses and inspection labs.
Tuesday 20 September 2022
Taiwan analog IC firms step up transition to 12-inch wafer manufacturing
Taiwan-based analog IC design houses have stepped up their transition to 12-inch wafer manufacturing, and are actively developing 12-inch chip designs, according to industry source...
Monday 19 September 2022
MediaTek to mass produce HPC chips with CoWoS tech in 2023
MediaTek is set to mass produce its new HPC chips at TSMC in 2023 using advanced process node and CoWoS (chip on wafer on substrate) packaging technology, according to backend supply...
Monday 19 September 2022
LCD monitor panel shipments down in August, says Discien
Global LCD monitor panel shipments reached 10.8 million units in August, decreasing 8% sequentially and 28% on year, according to Discien Consulting.
Monday 19 September 2022
Taiwan IC design houses keen to develop new chips, defying headwinds
Taiwan's IC design houses including MediaTek, Novatek Microelectronics and Realtek Semiconductor have sharply increased their new development projects for the next 1-2 years despite...
Monday 19 September 2022
Suppliers set to enter production race for 3D NAND with 200+ layers
Global NAND flash makers are on track to start a new round of competition in producing 3D NAND chips with over 200 layers after Micron Technology announced commercial production of...
Monday 19 September 2022
China gearing up to mass purchase IC equipment and materials
Chinese semiconductor firms are moving at full throttle to purchase as many semiconductor equipment and materials as possible from abroad as the US is expected to take tougher measures...
Monday 19 September 2022
Semiconductor manufacturing not affected by strong earthquake in Taiwan
A Richter 6.8 magnitude scale earthquake and aftershocks hit Taiwan on September 18, but as the epicenter was located off the southeastern coast of the island, semiconductor manufacturing...
Friday 16 September 2022
PCB maker Eiso steps into production of own-brand e-bikes
Niche-market PCB maker Eiso Enterprise is tapping overseas markets mainly in Europe for its own-brand Dosun electric bicycles (e-bikes), which it started developing and producting...