CONNECT WITH US
Global supply chain: Key components
Key components news coverage
IN THE NEWS
Monday 24 January 2022
Industry watch: Big issues must be addressed
Well known for industry clusters, Taiwan must think about developing a "Cluster 2.0" model, ASE COO Tien Wu has urged. How should it define the concept of "mutual home ground" across...
Monday 24 January 2022
Unisoc adopts Imagination NNA IP in new 5G smartphone chips
China's fabless chipmaker Unisoc has used Imagination's Series3NX neural network accelerator (NNA) IP in its Tanggula T770 and T760 system-on-chips (SoC) for 5G smartphones, according...
Monday 24 January 2022
Shanghai incentivizes development of IC equipment, EDA tools
The Shanghai municipal government has newly released a package of generous incentives to encourage investments in the development and production of semiconductor materials and equipment,...
Friday 21 January 2022
Compeq foresees intense high-end HDI PCB demand
Taiwan-based Compeq Manufacturing has expressed optimism about high-end HDI PCB demand in 2022, and expects its shipments for low-orbit satellites to double and to contribute 6-8%...
Friday 21 January 2022
Highlights of the day: Foldable smartphone will be a passing fad?
All the major smartphone providers, except Apple and Vivo, have announced they would release foldable smartphones in 2022. Among those brands, Samsung, Oppo, and Huawei already released...
Friday 21 January 2022
Asustek, Pegatron subsidiaries boost consolidated results
Asustek Computer and Pegatron have both seen their subsidiaries contribute considerably to their total revenues in 2021 and are optimistic about further revenue and profit gains driven...
Friday 21 January 2022
OmniVision enhances CIS in car, security applications
China's IC design industry has grown rapidly over the past two decades, and has gained a significant position in some segments such as CMOS image sensor (CIS) chips. Its leading CIS...
Friday 21 January 2022
MediaTek demos Wi-Fi 7 technology
MediaTek has showcased what the company claims is the world's first live demo of Wi-Fi 7 technology, and expects products with Wi-Fi 7 to hit the market starting in 2023.
Friday 21 January 2022
Wi-Fi 7 will spark demand for QFN packaging, burn-in testing
With chip vendors (including Broadcom, Intel, MediaTek, and Qualcomm) gearing up for the development of Wi-Fi 7 chip solutions, QFN packaging and burn-in testing demand will be ramping...
Friday 21 January 2022
Taiwan compound semi output value increases 26% in 2021
Taiwan's compound semiconductor output value grew about 26% on year to NT$83.5 billion (US$3 billion) in 2021, according to statistics compiled by the Photonics Industry & Technology...
Friday 21 January 2022
Hisense releases in-house-developed 8K AI image quality chip
TV vendor Hisense has released the Hi-View HV8107, an in-house-developed AI image quality chip for 8K TVs and the first model of its kind ever developed by any China-based company,...
Friday 21 January 2022
Industry watch: A new model of talent-driven industrial development
Former president of Industrial Technology Research Institute Chin-Tay Shih pointed out in a recent forum organized by Li Kwoh-ting Foundation that top US companies often use Research...
Thursday 20 January 2022
Samsung, Hyundai reportedly considering forming auto chip alliance
The top executives of Samsung Electronics and Hyundai Motor have reportedly met to discuss the possibility of the two companies forming an automotive semiconductor alliance recently,...
Thursday 20 January 2022
TV-use LCD panel prices may hit bottom at end of 1Q22
Prices for TV-use LCD panels are likely to reach a low point at the end of the first quarter of 2022 and will begin to stabilize in the second quarter.
Thursday 20 January 2022
Highlights of the day: Intel orders second High-NA EUV scanner
To quickly catch up with its two major rivals – TSMC and Samsung, Intel announced to adopt another ASML's High-NA...