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Global supply chain: Key components
Key components news coverage
IN THE NEWS
Monday 23 August 2021
Samsung regains top spot in 2Q21 chip rankings
Samsung Electronics replaced Intel as the number one quarterly semiconductor supplier in the second quarter of 2021, according to IC Insights.
Friday 20 August 2021
Highlight of the Day: Intel's plan to acquire GF gets hindered
The move of GF's plan for IPO is more likely to happen in the near future, which might make Intel's buyout plan vanish...
Friday 20 August 2021
Prices of 4G mobile chips to rise in 2H21
With mobile chip suppliers putting increased focus on 5G solutions, the supply of 4G smartphone chips is being scaled down. Prices of 4G mobile chips will be rising in the second...
Friday 20 August 2021
GF proceeds with IPO plan, likely to crush Intel's takeover bid
GlobalFoundries (GF) reportedly has quietly applied to US Securities and Exchange Commission for an IPO (initial public offering) listing on New York Stock Exchange in late 2021 or...
Friday 20 August 2021
New 3M glass bubbles enable faster, more reliable 5G infrastructure and devices
3M has introduced a new member of its high-strength hollow glass bubbles product line to provide a low-loss high-speed high frequency (HSHF) resin additive for composite materials...
Friday 20 August 2021
Global tablet market, 2Q 2021
Global tablet shipments reached 34.69 million units in the second quarter of 2021, down 3.5% sequentially and 12.5% on year.
Friday 20 August 2021
Global light vehicle production impacts now expected well into 2022
Unlike foundries' capacity constraints impacting mainly automotive MCUs, assembly capacity constraints impact all semiconductor types including sensors, power supplies, and discretes,...
Friday 20 August 2021
Taiwan wafer foundry industry, 3Q 2021
Thanks to ongoing strong chip demand, the top-3 Taiwan-based foundries - TSMC, UMC and VIS - performed outstandingly in second-quarter 2021 and will see revenue climb further in the...
Friday 20 August 2021
Amkor: Empowering RF front end cellular innovations with DSMBGA
With the introduction of 5G, cellular frequency bands have increased considerably, requiring innovative solutions for the packaging of RF front-end modules for smartphones and other...
Friday 20 August 2021
MediaTek intros 6nm chips for 5G smartphones
MediaTek has rolled out two new 5G smartphone chips built using TSMC's 6nm process technology.
Friday 20 August 2021
Intel unveils new chip architectures; expands partnership with TSMC
At Intel's Architecture Day 2021, two new X86 cores, two new datacenter SoCs and two discrete GPUs were introduced. Intel also disclosed it is among the top customers of TSMC, which...
Friday 20 August 2021
BOE Technology, Visionox Technology expanding OLED panel capacities
China-based display panel makers BOE Technology and Visionox Technology are expanding production capacities for OLED panels, according to China-based media reports.
Thursday 19 August 2021
Highlights of the day: China foundries to see strong profits
China-based foundries may not be able to provide manufacturing sevices using the most advanced processes, but they see strong demand from the domestic market. SMIC...
Thursday 19 August 2021
PCB firm Chin-Poon swings to profit in 2Q21
Automotive PCB specialist Chin-Poon Industrial swung to net profits of NT$89 million (US$3.2 million) in the second quarter of 2021 from losses a year earlier, with gross margin climbing...
Thursday 19 August 2021
Supply of chips for 4G applications falls short of demand
The supply of 4G product chips including power amplifiers (PAs) and smartphone application processors has fallen short of demand due mainly to the chip suppliers' increased focus...