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IN THE NEWS
Tuesday 14 September 2021
SMIC to build additional, considerable 28nm and above process capacity
China's Semiconductor Manufacturing International (SMIC) will be expanding production capacity for 28nm and above process technologies by 2024, which will considerably boost its overall...
Tuesday 14 September 2021
Taiwan makers increasingly immune to sharp TV panel price falls, says AUO chair
Chances are slim for LCD TV panel prices to plunge to the cash cost level and Taiwan panel makers are now much more immune to the ongoing round of price falls amid changing industrial...
Tuesday 14 September 2021
OSATs to see backend 5G AP shipments for Android handsets fall in 4Q21
Taiwan-based OSATs expect backend shipments of 5G APs for Android handsets to decline in fourth-quarter 2021, as they moved to reduce purchases of related test sockets in early September...
Monday 13 September 2021
Highlights of the day: China steps up investment in memory firms
China's Big Fund is stepping up investments in the country's memory sector in line with its push for IC self-sufficiency...
Monday 13 September 2021
MediaTek posts increased August revenue
MediaTek has reported revenue of NT$42.81 billion (US$1.55 billion) for August 2021, up 6.1% sequentially and 30.9% on year.
Friday 10 September 2021
Unimicron reports record August revenue
IC substrate and PCB maker Unimicron Technology enjoyed another month of record-high revenue in August, driven by robust orders and rising ASPs.
Friday 10 September 2021
Unisoc to see smartphone AP shipments hike in 2H21
China's Unisoc will see shipments of its smartphone application processors hike over 100% on year in the second half of 2021, according to Digitimes Research.
Friday 10 September 2021
Taiwan OSATs install additional wire-bonding equipment
Taiwan OSATs, including ASE Technology, Greatek Electronics, Lingsen Precision Industries and Orient Semiconductor Electronics (OSE), have all begun to install additional wire-bonding...
Friday 10 September 2021
China silicon wafer maker secures CNY3.3 billion in Series B
Hangzhou Semiconductor Wafer, a silicon wafer subsidiary owned previously by Japan's Ferrotec, has closed CNY3.3 billion (US$510 million) in its Series B funding round and will be...
Thursday 9 September 2021
Highlights of the day: Taiwan IC vendors set to raise prices
Tight supply has pushed up foundry costs, fueling pressure on IC design clients. First-tier IC design houses are now...
Thursday 9 September 2021
Wire-bonding to be increasingly needed to process car-use IGBT, SiC modules, says K&S VP
As the relatively mature wire-bonding technology continues to advance, it has become fully suitable for processing automotive silicon-based IGBT modules, and SiC (silicon carbide)...
Thursday 9 September 2021
UMC, VIS see revenue hit another record highs
Pure-play foundry United Microelectronics (UMC) saw its August revenue hit a record high for the fourth consecutive month, while revenue at fellow foundry company Vanguard International...
Thursday 9 September 2021
ESMT remains optimistic
Specialty DRAM IC design specialist Elite Semiconductor Memory Technology (ESMT) remains upbeat about its shipment prospects for the rest of this year, thanks to its diversified client...
Thursday 9 September 2021
Zhen Ding, Flexium post double-digit revenue gains in August
Flexible PCB specialists Zhen Ding Technology and Flexium Interconnect both saw their August revenues register double-digit sequential gains to hit new highs, mainly driven by strong...
Thursday 9 September 2021
Taiwan PCB output value up 19.7% in 1H21
Taiwan-based PCB manufacturers saw their combined output value reach NT$355.7 billion (US$12.62 billion) in the first half of 2021, up 19.3% on year and the highest-ever record for...