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Friday 22 January 2021
Kinsus to expand ABF substrate capacity by 30% in 2021
Taiwan-based IC substrate maker Kinsus Interconnect Technology plans to restore a fire-hit flexible PCB (FPCB) plant in Hsinchu, northern Taiwan, and convert it to produce ABF substrates...
Friday 22 January 2021
Intel reports record revenues for 2020
Intel has reported record revenues for 2020 at US$77.9 billion, up 8% on year, with its board of directors approved a cash dividend increase of 5% to US$1.39 per share on an annual...
Friday 22 January 2021
China panel makers step up AMOLED capacity expansions
China-based panel makers including BOE Technology, China Star Optoelectronics Technology (CSOT), Tianma Microelectronics and Visionox are all moving to build additional production...
Friday 22 January 2021
TSMC, NTU expand R&D partnership to quantum materials
TSMC and National Taiwan University (NTU) have expanded their collaboration in technology development to quantum materials research.
Friday 22 January 2021
Taiwan IC design houses likely to see sales growth constrained in 1Q21
With foundry capacity staying tight, coupled with longer delivery lead times at backend houses, Taiwan-based IC design houses are likely to see their sales growth constrained in the...
Friday 22 January 2021
Powerchip runs 12- and 8-inch fabs at nearly full utilization
Powerchip Semiconductor Manufacturing (PSMC) has run its 12- and 8-inch wafer fabs at nearly full capacity utilization, according to the Taiwan-based foundry.
Thursday 21 January 2021
Highlights of the day: DRAM pricing to remain robust
Strong demand from various product sectors and tight supply from chip vendors, DRAM pricing is expected to stay robust...
Thursday 21 January 2021
No capacity overbooking seen for high-end PCB products
Downstream clients have neither registered overly-high inventory levels for high-end PCB products nor overbooked capacity at PCB makers, as they are still striving to satisfy strong...
Thursday 21 January 2021
GaAs foundry AWSC raises quotes
GaAs foundry Advanced Wireless Semiconductor Company (AWSC) has notified its clients about an around 10% hike in its 6-inch foundry quotes, according to industry sources.
Thursday 21 January 2021
Lenovo plans to debut on China STAR market
Lenovo has disclosed plans to trade its shares on the science and technology innovation board (STAR) of China's Shanghai Stock Exchange (SSE).
Thursday 21 January 2021
HDI PCB makers see clear order visibility through 2Q21
Taiwan-based HDI PCB manufacturers have seen demand for smartphones and notebooks continue ramping up significantly, with clear order visibility extended to the second quarter, according...
Thursday 21 January 2021
Next-gen iPhones to all feature sensor-shift stabilization technology, say sources
Apple's next-generation iPhones slated for launch in the second half of 2021 will all come with sensor-shift stabilization technology, according to industry sources.
Thursday 21 January 2021
Qualcomm rolls out new 7nm 5G smartphone chip
Qualcomm has rolled out its new Snapdragon 870 series to further enhance its 5G smartphone chip lineup. The new 5G chip is built using TSMC's 7nm process technology.
Thursday 21 January 2021
MediaTek launches 6nm 5G SoC chips
MediaTek has unveiled its new Dimensity 1200 and 1100 5G smartphone SoC series built using 6nm process technology.
Wednesday 20 January 2021
R&D spending by semiconductor companies to hit another record high in 2021
Research and development spending by semiconductor companies worldwide is forecast to grow 4% in 2021 to US$71.4 billion after rising 5% in 2020 to a record high of US$68.4 billion,...