Intel and SK Hynix have signed an agreement under which the latter would acquire the former's NAND memory and storage business for US$9 billion, according to the companies.
With Taiwan sustaining its firm leadership in the global PCB industry, China has been fast catching up due to its heavy capital expenses over the past five years, and PCB makers in...
Suppliers of LCD driver ICs have seen an influx of rush orders from panel makers in Taiwan and China who are ramping up their output to meet increasing panel demand from the IT and...
Taiwan's PCB makers Compeq Manufacturing and Unimicron, both now supplying SLP mainboards for iPhone 12 mini and iPhone 12 Pro Max, are likely to land additional orders from Apple...
The current tight wire bonding (WB) packaging capacity at Taiwan's IC backend service firms is likely to last beyond the first quarter of 2020 thanks to strong demand from analog...
Semiconductor equipment maker Foxsemicon Integrated Technology, an affiliate of the Foxconn Group, broke ground for a smart manufacturing plant in Chunan of northern Taiwan on October...
AUO has dismissed reports claiming that its plant in Kunshan, China has been ordered to halt operations after one of its Taiwanese employees there was tested positive for COVID-19.
TSMC expects to post revenues of between US$12.4 billion and US$12.7 billion in the fourth quarter of 2020, which is a 3.4% sequential increase at the midpoint. Gross margin and operating...
Innolux's operations have been improving as it has managed to overcome the most of adverse fallouts from the coronavirus pandemic, according to company president James Yang.
GaAs foundry Win Semiconductor and its backend partners including Elite Advanced Laser (eLaser) are engaged in production of VCSEL chips for ToF-based LiDAR scanner for the iPhone...
Zhen Ding Technology, Compeq Manufacturing and Unimicron Technology have together landed nearly 60% of total substrate-like PCB (SLP) orders placed by Apple for its new iPhone 12...
Apple's custom-designed ultra wideband (UWB) chip featured in the just-unveiled HomePod mini smart speaker is built using ASE Technology's SiP packaging technology, according to industry...
Global silicon wafer shipments are set to increase 2.4% on year in 2020 after falling 6.9% in 2019, with growth continuing in 2021 and 2022, according to SEMI.
