Taiwan-based touch display specialist General Interface Solutions (GIS) is expected to ramp up shipments through at least the second quarter of 2020 as it starts fulfilling orders...
China-based PCB manufacturer Shennan Circuits has reported net profits surged 76.8% from a year earlier to CNY1.23 billion (US$177.7 million) in 2019, when revenues climbed 38.4%...
Infineon Technologies has worked with Qualcomm Technologies to develop a reference design for 3D authentication based on the latter's Snapdragon 865 Mobile Platform.
Global shipments of monitor panels are expected to reach 166 million units in 2020, increasing 15.2% from a year earlier, according to market research firm All View Cloud (AVC).
Taiwan-based flexible PCB makers in the supply chain of Apple devices will see their shipments for the upcoming entry-level iPhone SE2 deferred from the first quarter to the second,...
Huawei has been strengthening its in-house chip design capability aiming to further reduce its dependence on US technology, according to industry sources.
Taiwan-based server management SoC solution provider Aspeed Technology expects its second-quarter revenues to see a double-digit sequential increase thanks to robust orders from cloud...
Apple's new entry-level LCD iPhone, tentatively dubbed iPhone SE2, has entered the final stage of engineering validation in Zhengzhou, China, where the vendor's major manufacturing...
BOE Technology is expected to continue to enhance its presence in the flexible AMOLED panel sector as handset brands including Samsung Electronics and Huawei remain committed to rolling...
Taiwan-based MCU specialists have enjoyed an influx of short lead-time orders for healthcare applications, mainly ear thermometers, since February, and are ramping up wafer starts...
HannStar Board will put increased focus on its deployments in the networking device and server segments in 2020 as part of its efforts to further improve its product mix and boost...
Lam Research has announced the launch of Sense.i with core technology evolved from Lam's Kiyo and Flex process module. The Sense.i platform enables the etch capabilities required...
