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Global supply chain: Key components
Key components news coverage
IN THE NEWS
Monday 2 December 2019
Chipmakers, partners moving to secure 5G key components inventory
Mobile chipmakers are gearing up to secure stronger support from supply chain partners aiming to gain a greater presence in the market for 5G smartphones whose shipments are estimated...
Friday 29 November 2019
Nuvoton to buy Panasonic chip unit
Panasonic has agreed to sell its semiconductor business to Nuvoton Technology, a Taiwan-based MCU specialist majority owned by memory chipmaker Winbond Electronics.
Friday 29 November 2019
IC designers poised to reap well from 5G peripheral chips demand
Taiwan-based IC designers are gearing up to cash in on the growing demand for high-speed, high-performance peripheral chips including Type-C interface chipts, USB 4.0 chips, diverse...
Friday 29 November 2019
Taiwan chipmakers optimistic about demand for TWS earbuds in 2020
Chip demand for true wireless stereo (TWS) earbuds and earphones is set to remain robust in 2020, according to industry sources in Taiwan.
Friday 29 November 2019
Chinese makers to see 2019 earnings double on strong HLC PCB demand
China's leading PCB makers Shennan Circuits and Wus Printed Circuit are expected to see their net earnings for 2019 double from 2018 on robust demand for high-layer-count (HLC) PCBs...
Friday 29 November 2019
Cooling module makers eyeing robust application demand for 5G devices
The commercialization of 5G communication networks will spur the growth of both base station and smartphone markets, which in turn will significantly drive demand for high-performance...
Friday 29 November 2019
Panasonic to exit semiconductor business
With its decision to sell its chipmaking operations to Taiwan's Nuvoton Technology, Panasonic will leave the chipmaking industry where it was once among the world's top-10 players...
Thursday 28 November 2019
Metal stamping firm Anli to install new production lines in China
Anli International is planning to establish a sintering production line at its factory site in Zhejiang, China to provide etching process for its vapor chamber products with volume...
Thursday 28 November 2019
Innolux develops ODTG-based all-screen panels for handset applications
Innolux has introduced its own ODTG (one data triple gate) circuit technology for the production of all-screen panels for handset applications, with volume production scheduled to...
Thursday 28 November 2019
AWSC expanding 6-inch GaAs foundry capacity for 5G devices
GaAs foundry Advanced Wireless Semiconductor (AWSC) is gearing up for capacity expansion to satisfy ever-expanding demand for 5G RF (radio frequency), PA (power amplifier), WiFi 6...
Thursday 28 November 2019
CCL firm EMC gearing up for 5G handset application orders
As motherboard upgrades at 5G smartphones are gaining momentum, Taiwan-based CCL maker is poised to compete with Japanese peer Panasonic to benefit more from the first wave of 5G...
Thursday 28 November 2019
TSMC and UTokyo announce semiconductor tech collaboration
The University of Tokyo and TSMC have announced an alliance to pursue organization-wide collaboration in leading-edge semiconductor technology. Under the alliance, TSMC will provide...
Wednesday 27 November 2019
WT Micro says tender offer by WPG raises concerns among customers
WPG's tender offer for WT Microelectronics shares has raised concerns among the latter's customers as well as suppliers, according to WT Micro chairman and CEO Eric Cheng.
Wednesday 27 November 2019
Highlights of the day: MediaTek launches Dimensity 5G SoC
MediaTek has launched its next-generation 5G SoC family, Dimensity. The launch made a splash with high-ranking executives from many fellow semiconductor firms, including TSMC and...
Wednesday 27 November 2019
MediaTek intros new-gen 5G SoC
MediaTek held a press conference on November 26 to introduce the new generation of its 5G SoC chips, with guests including TSMC VP Lora Ho, a number of high-ranking executives from...